Packaging

Intel Advances Progress in Integrated Photonics for Data Centers

Today, at Intel Labs Day, Intel highlighted industry-leading technological advances toward the realization of the company’s long-standing vision of integrating photonics with low-cost, high-volume silicon.

Nanomaterials Enable Dual-Mode Heating and Cooling Device

Engineers at Duke University have demonstrated a dual-mode heating and cooling device for building climate control that, if widely deployed in the U.S., could cut HVAC energy use by nearly 20 percent.

MagnaChip Launches New High-Voltage 700V/800V Super Junction MOSFETs

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX) today announced eight new 700V and 800V series high-voltage Super Junction Metal Oxide Semiconductor Field Effect Transistors (SJ MOSFETs), featuring high performance and efficiency and optimized for TV, LED lighting and fast charger applications.

IAR Systems and GigaDevice Extend Partnership With Powerful Arm Solutions

IAR Systems, the future-proof supplier of software tools and services for embedded development, and GigaDevice, an industry-leading semiconductor supplier, announced their powerful solutions for GD32 Arm-based microcontrollers (MCUs).

Third-Quarter 2020 Global Semiconductor Equipment Billings Surge 30% Year-Over-Year, SEMI Reports

Global semiconductor equipment billings surged 30% year-over-year and rose 16% to US$19.4 billion from the prior quarter, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

Status of the Advanced Packaging Industry

Revolutionary changes are happening in the advanced semiconductor packaging industry.

STMicroelectronics Reveals Compact 60V DC/DC Converters Featured for Extra Flexibility

The STMicroelectronics L7983 is a compact, 3V-60V, 300mA synchronous DC/DC buck converter with flexible, dynamic-mode selection to satisfy noise-sensitive applications and maximize efficiency at light load.

Dialog Semiconductor Selected by AST & Science as the Preferred Supplier for Advanced Communication Custom ICs

Dialog Semiconductor plc, a provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions today announced that AST & Science, LLC, a satellite company that is disruptively transforming satellite broadband access, has selected Dialog to develop four custom mixed-signal & RF ASICs for their SpaceMobile network.

STMicroelectronics and Advantest Collaborate on Advanced Automated Test Cell for IC Testing

Semiconductor test equipment supplier Advantest Corporation and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that they have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.

TechSearch International Examines HBM Growth and Package Options for HBM + Logic

The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from 2020 to 2024.

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