CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
Packaging
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing.
Memory in a Metal, Enabled by Quantum Geometry
The emergence of artificial intelligence and machine learning techniques is changing the world dramatically with novel applications such as internet of things, autonomous vehicles, real-time imaging processing and big data analytics in healthcare.
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
ZEISS today introduced the Advanced Reconstruction Toolbox for its industry-leading Xradia Versa series of non-destructive 3D X-ray microscopes (XRM) and its Xradia Context 3D X-ray micro-computed tomography (microCT) systems.
KIOXIA Launches First PCIe Gen4 NVMe U.3 SSDs for HPE Servers
KIOXIA America, Inc., is the first1supplier to launch PCIe Gen4 NVM Express (NVMe) data center-class solid-state drives (SSDs) within the HPE NVMe mainstream performance SSD portfolio available on HPE ProLiant, HPE Synergy and HPE Apollo servers.
Changes to Bosch Rexroth Management in North America
Paul Cooke, President and CEO of Bosch Rexroth North America, based in Charlotte, NC, USA, will retire on December 31, 2020 after 38 years of distinguished service in various international positions within Bosch Rexroth. His successor as of December 1, 2020 will be Greg Gumbs, most recently Vice President & General Manager Electrical Automation Solutions at EATON Corporation. Greg will join Bosch Rexroth effective September 1, 2020 in preparation for…
Olympus and Lavender International Collaborate to Support Advanced NDT Training
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, has provided its new OmniScan X3 phased array flaw detectors with FMC/TFM to Lavender International’s US facility to support their advanced training courses.
Kneron Unveils Next-Gen AI Chip — No Compromise AI For Smart Devices
Kneron, the San Diego-based edge AI solutions provider backed by the likes of Alibaba, Sequoia, Horizons Ventures, Qualcomm, and SparkLabs Taipei, today announces its new state of the art AI chip: the Kneron KL720.
Research Shows Thin-Film Lithium Niobate Photonic Integrated Circuits are Fundamentally Scalable and Highly Cost-Effective, Ideal for Use in Telecommunications and Quantum Computing
Scientists from HyperLight, a leader in the commercialization of lithium niobate (LN) integrated optical circuits, have teamed with Harvard University researchers to achieve a significant technical milestone for photonic integrated circuits (PICs).
Cadence IC Packaging Reference Flow Certified for the Latest TSMC Advanced Packaging Solutions
Cadence Design Systems, Inc. today announced the certification of the Cadence tools in TSMC reference flows for TSMC’s latest InFO and CoWoS advanced packaging solutions, the Integrated Fan-Out with RDL interconnect (InFO-R) and Chip-on-Wafer-on-Substrate with silicon interposer (CoWoS-S).
