proteanTecs, a developer of Deep Data solutions for electronics’ health and performance monitoring, will present at the Taiwan Semiconductor Executive Summit (TSES), taking place in Hsinchu on December 1-2, 2020.
Packaging
Qorvo CEO Bob Bruggeworth Elected Chair of Semiconductor Industry Association
The Semiconductor Industry Association (SIA) Board of Directors today elected Bob Bruggeworth, President, CEO, and Director of Qorvo, as its 2021 Chair and Steve Mollenkopf, CEO and Director of Qualcomm Incorporated, as its 2021 Vice Chair.
Perfect Imperfection: Electrode Defects Boost Resistive Memory Efficiency
Resistive switching memory devices offer several advantages over the currently used computer memory technology. Researchers from the MIPT Atomic Layer Deposition Lab have joined forces with colleagues from Korea to study the impact of electrode surface morphology on the properties of a resistive switching memory cell.
ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications.
Alchip Technology Announces Record Q3 Earnings
Alchip Technologies third quarter of 2020 achieved a record net income $7.87 million on record revenue of $67.68 million. The company also reported continued growth in the high-performance computing market segment.
Collaboration Helps Military Veterans Transition into NDT Careers
Olympus, a leading manufacturer of nondestructive testing (NDT) equipment, is supporting training school Warrior To Inspector’s mission to help transition retiring military veterans into a new NDT career by providing advanced inspection instruments for their ultrasonic testing (UT) courses.
Xperi Licenses DBI to Canon for CMOS Image Sensors
Xperi Holding Corporation today announced Canon’s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors.
Jenoptik Offers Novel UFO Probe Card for PIC Wafer Level Testing
Jenoptik’s new UFO Probe technology targets the market for semiconductor equipment and processes for wafer-level testing in microelectronics.
Marvell Announces Industry’s First 112G 5nm SerDes Solution for Scaling Cloud Data Center Infrastructure
Marvell today unveiled the industry’s first 112G 5nm SerDes solution that has been validated in hardware.
CyberOptics to Present Technical Paper ‘Fast, 100% Wafer Bump Metrology and Inspection’ at Virtual IEEE PAINE Conference
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
