Intel today announced that it is among the leading U.S. quantum technology companies included in Q-NEXT, one of five new national quantum research centers established by the White House Office of Science and Technology Policy (OSTP) and the U.S. Department of Energy (DOE).
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Keysight Survey Reveals True Costs of Time Delays Caused by Test Equipment Misconfiguration, Maintenance and Training Issues
Keysight Technologies, Inc. has released the results of a third-party survey, conducted by Dimensional Research, that shows nearly all companies who design and develop electronic products, experience costly and preventable delays related to test equipment misconfiguration, maintenance or training issues.
Synopsys Collaborates with TSMC to Accelerate 3nm Innovation, Enabling Next-Generation SoC Design
Synopsys, Inc. (Nasdaq: SNPS) today announced that TSMC has certified Synopsys’ digital and custom design platforms for TSMC’s 3-nanometer (nm) process technology. This certification, based on TSMC’s latest design rule manual (DRM) and process design kits (PDKs), is the result of an extensive collaboration with rigorous validation to deliver design solutions for optimized power, performance, and area (PPA), which accelerate the path to next-generation designs.
Marvell and TSMC Collaborate to Deliver Industry’s Most Advanced Data Infrastructure Portfolio on 5nm Technology
With this collaboration, Marvell and TSMC are advancing the essential technology underpinning this infrastructure to provide the storage, bandwidth, speed, and intelligence that tomorrow’s digital economy demands.
SEMI Statement on New U.S. Export Control Regulations
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement in response to the new export control rule changes announced by the United States Commerce Department.
High-Function Polyol Additives Improve Performance of Electronics Adhesives
Adhesives used in electronics assemblies must perform without fail to protect delicate components from vibration and heat. They must also be able to secure the components without interfering with the operation of the end product.
Monzukuri Unveils First Commercially-Available IC/Package Co-Design Tool
Monozukuri S.p.A, today unveiled GENIO, the first commercially available IC/Package Co-Design Tool. The company said that it is able to take orders for GENIO now. GENIO is revolutionary fully integrated, design environment-agnostic end-to-end IC and packaging co-design EDA platform for 2D/2.5D/3D system design.
Consumer Electronics Market is Set to Surpass $1,500B by 2026
According to a recent study from market research firm Global Market Insights, the demand for consumer electronics market is anticipated to grow at a significant rate on account of increasing purchase of devices integrated with latest technologies.
TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries
TrendForce provides the following analyses on the impacts that the expanded sanctions against Huawei have on five tech industries, including semiconductors, memory products, smartphones, display panels, and 5G communications.
Subaru Selects Xilinx to Power New-Generation EyeSight System
Xilinx, Inc. (NASDAQ: XLNX) today announced that its technology is powering the new version of Subaru’s vision-based advanced driver-assistance system (ADAS), EyeSight.
