IC Insights released its June Update to the 2020 McClean Report earlier this month. This Update included a 2018-2024 IC database that segmented the IC market by major product type including Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, China, and Asia-Pacific regions.
Packaging
QuickLogic Announces Open Reconfigurable Computing Initiative
QuickLogic Corporation today announced its ground breaking QORC (QuickLogic Open Reconfigurable Computing) initiative, making it the first programmable logic vendor to actively embrace a fully open source suite of development tools for its FPGA devices and eFPGA technology.
Dow Introduces Easy-to-Dispense Gap Filler with Strong Thermal Conductivity and Slump Resistance for Efficient Assembly
Dow introduced today new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.
NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform
NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.
SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.
The bipartisan legislation would improve the competitiveness of semiconductor research, design and manufacturing in the United States, resulting in the creation of thousands of new jobs and bolstering national security.
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Towards application of materials informatics to development of thermal functional materials.
Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact
Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.
Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology.
CMOS Image Sensors to Resume Record Run in 2021
The fallout from the Covid-19 virus crisis in 2020 is expected to lower CMOS image sensor sales for the first time in 10 years, but new record-high revenues are seen next year, says new O-S-D Report.
