Packaging

Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.

Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology

Xperi Holding Corporation and Tower Semiconductor, a global leader in high-value analog semiconductor foundry solutions, today announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies.

StratEdge Expands Production Capacity of its RF Packaging Line

StratEdge Corporation announces the expansion of its production line for building ceramic and molded ceramic packages to support 5G infrastructure demands.

Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports

2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion.

Advanced Manufacturing Facility Driving Innovation in High-Performance Electronics Unveiled by Benchmark and Arizona Government Leaders

Benchmark (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today held a virtual grand opening of its new advanced electronics manufacturing facility in Phoenix. Benchmark’s President and CEO Jeff Benck hosted the live webcast and was joined virtually by several dignitaries including Arizona Governor Doug Ducey and Phoenix Mayor Kate Gallego.

Business Confidence in IT Spending Declines Despite Moves to Ease Economic Lockdown, According to IDC COVID-19 Tech Index

Business confidence levels declined in the last week of May, according to the latest update to the IDC COVID-19 Tech Index. IT buyers in the US, Western Europe, and some parts of Asia/Pacific indicated that they now expect total IT spending to decline by more than previously anticipated. This is in spite of a general stabilization in other market indicators over the past month, as many countries prepare to tentatively move into a gradual recovery phase.

IAR Systems Launches Support for the RISC-V P Extension for Packed-SIMD Instructions

IAR Systems, the future-proof supplier of software tools and services for embedded development, today announces initial support for the draft RISC-V P extension in its powerful development tools IAR Embedded Workbench for RISC-V.

Lattice Accelerates FPGA-based Processor Design with New IP Ecosystem and Design Environment

Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced Lattice Propel™, a new software solution designed to accelerate development of unique applications based on low power, small form factor Lattice FPGAs.

COVID-19 Decimates Automotive Power Semiconductor Revenue in 2020

The COVID-19 pandemic is wreaking havoc on sales of automotive power semiconductors, with falling demand for motor vehicles causing global market revenue to decline by 16 percent in 2020.

Cadence Achieves Digital and Custom/Analog EDA Flow Certification for TSMC N6 and N5 Process Technologies

Cadence Design Systems, Inc. today announced that its digital full flow and custom/analog tool suites have been further enhanced to deliver optimal results on TSMC’s N6 and N5 process technologies.

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