SiFive, Inc., the provider of commercial RISC-V processor IP and silicon solutions, today announced OpenFive, a self-contained and autonomous business unit to capture the opportunity offered by enabling customizable, silicon-focused solutions with differentiated-IP.
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Rahul Goyal of Intel Re-elected Board Chair of Silicon Integration Initiative
Rahul Goyal, vice president and director of R&D strategic enablement at Intel, has been re-elected to a one-year term as chairman of the board of directors of Silicon Integration Initiative, a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
2D Materials for Ultrascaled Field-Effect Transistors
With the increasing miniaturization of electronic components, researchers are struggling with undesirable side effects: In the case of nanometer-scale transistors made of conventional materials such as silicon, quantum effects occur that impair their functionality.
Embedded System Market Is Set to Surpass $160B by 2026
The market is anticipated to experience remunerative growth trends in the forthcoming timeframe due to its applications across numerous fields such as automotive, telecommunication, healthcare, industrial, consumer electronics, and aerospace & defense among others.
Mycropore Expands Customer Base with Orders from Two North American Memory IC and RF IC Manufacturers
Mycropore Corporation Ltd., a leading supplier of micro-contamination control and filtration solution provider for advanced semiconductor IC manufacturers, today announced the receipt of repeat purchase orders from two leading North America-based customers who manufacture Memory IC and RF IC devices that serve the fast growing 5G market.
Alchip Technologies Opens5nm ASIC Design Capabilities
Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December.
Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today’s most advanced process nodes.
QuickLogic Joins CHIPS Alliance to Expand Open Source FPGA Efforts
QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, announced that it has joined the CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems.
Electronic Components Join Forces to Take Up 10 Times Less Space on Computer Chips
A new study demonstrates the successful integration of the individual elements that make up electronic filters onto a single component, significantly reducing the amount of space taken up by the device.
Lion Semi Switched-Cap Power ICs in More than 50 Million Smartphones
Lion Semiconductor, a leading provider of switched-capacitor power ICs with world’s highest efficiencies, today announced its switched-capacitor power ICs are used in more than 50 million smartphones. This milestone comes 2 years after the company started production shipment.
