Tachyum Inc. today announced that its Prodigy Universal Processor has successfully completed software emulation testing across x86, ARM and RISC-V binary environments.
Packaging
SEMI and EDA Industry Leaders Unite to Combat Software Piracy
SEMI, Cadence, Mentor, a Siemens Business, and Synopsys today announced plans to jointly develop an industry-standard protocol to combat electronic design automation (EDA) software piracy, a growing and costly problem for software vendors and their users.
Analog Devices Collaborates with Intel on Radio Platform for Addressing 5G Network Design Challenges
Analog Devices, Inc. (ADI) today announced its collaboration with Intel Corporation to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
GLOBALFOUNDRIES Appoints David Reeder as Chief Financial Officer
David will draw on his more than 20 years of global financial and executive management experience with public and private companies to support GF’s growth and continued success as the world’s leading specialty foundry as well as accelerate the company’s journey to IPO.
Greg Lang Joins Rambus Board of Directors
Rambus Inc., a premier silicon IP and chip provider dedicated to delivering data faster and safer, today announced the appointment of Greg Lang to its Board of Directors, effective immediately.
Low-Profile Surface-Mount Schottky Diodes from STMicroelectronics Boost Power Density and Efficiency
STMicroelectronics has launched 26 new Schottky diodes in low-profile SMA and SMB Flat packages, covering voltage ratings from 25 to 200V and current ratings from 1 to 5A.
Rare Earth Elements Supply Uncertain for IC Fabs
TECHCET announces supply-chain challenges ahead for Rare Earth Elements (REE) for semiconductor device manufacturing, due to ongoing global pandemics and trade-wars.
Intel Makes Changes to Technology Organization
Today, Intel CEO Bob Swan announced changes to the company’s technology organization and executive team to accelerate product leadership and improve focus and accountability in process technology execution.
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024, SEMI and TechSearch International Report
The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in 2019 to $20.8 billion in 2024, a 3.4 percent Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast in the Global Semiconductor Packaging Materials Outlook released today.
North American Semiconductor Equipment Industry Posts June 2020 Billings
North America-based manufacturers of semiconductor equipment posted $2.32 billion in billings worldwide in June 2020 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
