Dialog Semiconductor plc(XETRA:DLG), a leading provider of battery and power management, Wi-Fi, Bluetooth low energy (BLE) and Industrial edge computing solutions, today announced the SLG47004, Dialog’s first Advanced Analog GreenPAK IC.
Packaging
3D-Micromac Unveils High-Throughput Selective Laser Annealing System for Magnetic Sensor Manufacturing
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the first industrial selective laser annealing system for magnetic sensor formation — the microVEGA™ xMR. Incorporating a highly flexible, high-throughput tool configuration with on-the-fly spot and variable laser energy, the microVEGA xMR accommodates both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjusts magnetic orientation, sensor position…
2020 IEEE International Electron Devices Meeting (IEDM) Announces Virtual Events Schedule & Technical Highlights
The 66th annual edition of the IEEE International Electron Devices Meeting (IEDM), the world’s premier forum for the presentation of applied research in transistors and related devices, has announced the details of its virtual schedule.
DRAM Price Erosion Expected Through the End of 2020
Price jump that typically coincides with the introduction of new smartphone models in 3Q and 4Q is not expected due to disrupted buying patterns and cautious discretionary spending.
CEA-Leti to Present Latest Results & Insights on 3D Technologies, Power Electronics & Quantum Computing at IEDM 2020
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.
SK hynix to Acquire Intel NAND Memory Business
SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021.
Optoelectronics, Sensors/Actuators, Discretes Stabilize in Covid-19 Crisis
About eight months after the Covid-19 virus pandemic accelerated around the world, sales of optoelectronics, sensors and actuators, and discrete semiconductors have stabilized, and in some cases, revenues have begun showing signs of a slight recovery in the second half of 2020
IAR Systems Brings Functional Safety Tools to RISC-V With Certification For IEC 61508 and ISO 26262
IAR Systems, the future-proof supplier of software tools and services for embedded development, further extends its strong tools offering for RISC-V by announcing a certified version of its development tools.
Next-Generation Computer Chip With Two Heads
It’s a major breakthrough in the field of electronics. Engineers at EPFL’s Laboratory of Nanoscale Electronics and Structures (LANES) have developed a next-generation circuit that allows for smaller, faster and more energy-efficient devices – which would have major benefits for artificial-intelligence systems.
System Integration Key to First IC/Package Co-Design Tool Success
A proprietary system integration platform is proving the key to early trial success of MZ Technology’s GENIO IC/Package Co-Design EDA Tool. GENIO became the first commercially available IC/Package Co-Design Tool when MZ Technologies began taking order in August.
