The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer, urging Senate approval of the House-passed Tax Relief for American Families and Workers Act (H.R. 7024).
Packaging
JEOL Releases New Schottky Field Emission Scanning Electron Microscope
JEOL Ltd. announced the release of the new Schottky Field Emission Scanning Electron Microscope JSM-IT810 on July 28, 2024.
Alphawave Semi Launches Industry’s First 3nm UCIe IP with TSMC CoWoS Packaging
Alphawave Semi has launched the industry’s first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology.
Nordson Electronics Solutions Completes its Europe Location Move to a New Facility
Nordson Electronics Solutions announced that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
Micron Announces Volume Production of Ninth-Generation NAND Flash Technology
Micron Technology, Inc. announced today that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
Dr. Chandrasekaran succeeds retiring Keyvan Esfarjani as chief global operations officer.
KIOXIA Honored by FMS With Lifetime Achievement Award for 3D NAND Flash Invention
KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024.
