A research team led by Prof. ZENG Hualing, Prof. QIAO Zhenhua, and Prof. SHAO Xiang from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences (CAS) achieved progress in studying van der Waals (vdW) contacts for two-dimensional (2D) electrical devices.
Packaging
CEA-Leti Scientists Detail Progress on 3D Integration Technologies and Promising Approaches for More Than Moore and RF Integrated Systems at VLSI
CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute’s progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.
QP Technologies Expands Die Preparation Business
QP Technologies, a provider of innovative microelectronic packaging and assembly solutions, today announced it has added a dicing saw to its manufacturing line, expanding its die and wafer preparation business.
BAE Systems and GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs
Collaboration to focus on U.S. chip manufacturing and joint research and development for advanced chip technologies.
Silicon Wafers High Growth Now Uncertain
Excess inventory causing concerns and upturn in orders not yet realized.
Valin Corporation Now Offers Pneumatics Control Panels with UL 508 A Certification
Valin Corporation, a provider of technical solutions for the technology, energy, life sciences, natural resources, and transportation industries announces its latest addition to Valin Engineered Solutions – Pneumatics Control Panels.
onsemi Selects the Czech Republic to Establish End-to-End Silicon Carbide Production for Advanced Power Semiconductors
Brownfield investment would bring critical manufacturing capabilities of energy efficient chips to Central Europe to power the future of electrification, renewables and AI.
Quantum Leap Solutions Named Authorized Reseller for Synopsys for North America
Quantum Leap Solutions announced its recent appointment as an authorized North American reseller for Synopsys’ comprehensive suite of EDA, semiconductor IP, and cloud solutions.
U.S. Department of Commerce Announces Two New Commitments to the CHIPS Women in Construction Framework
Announcement is part of Secretary Raimondo’s Million Women in Construction Initiative.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
