Packaging

Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020

First-quarter sales decreased 3.6 percent compared to the previous quarter, which is in line with typical seasonal trends, and increased 6.9 percent compared to the first quarter of 2019.

STMicroelectronics Helps Meet Functional-Safety Norms with Certified Software for STM32 and STM8 Families

STMicroelectronics has released three functional-safety packages that simplify development of safety-critical industrial, medical, consumer and automotive products based on STM32 and STM8 microcontrollers and microprocessors.

Vacuum Systems for the Treatment of COVID-19 Patients in Brazil

Brazil currently has the most confirmed COVID-19 cases in South America. Already in March, hospital capacities for intensive medical care of corona patients were expanded, and several field hospitals were established.

Aldec’s New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the ‘Price/Performance’ Sweet Spot

Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a new FPGA accelerator board for high performance computing (HPC), high frequency trading (HFT) applications and high speed FPGA prototyping.

Synopsys Introduces 3DIC Compiler, Industry’s First Unified Platform to Accelerate Multi-die System Design and Integration

Synopsys, Inc. (Nasdaq: SNPS) today introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an unprecedented fully integrated, high-performance, and easy-to-use environment, offering architectural exploration, design, implementation, and signoff with signal, power, and thermal integrity optimizations, all in one solution.

SiFive Joins Open COVID Pledge to Fight Global Pandemic

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced…

Reno Sub-Systems Introduces New Line of Integrated RF Match and Generator Systems

Reno Sub-Systems, Inc. (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced its first all solid state generator and RF matching system, developed to support a repeat customer of Reno’s Velocity RF Matching Networks.

Intel and MIC Announce Scale to Serve Program to Rapidly Expand Remote ICUs to 100 US Hospitals

As part of Intel’s $50 million pandemic response, Intel and Medical Informatics Corp. (MIC) today announced the Scale to Serve Program to help hospitals rapidly install and scale MIC’s Sickbay platform.

IAR Systems Opens Office in India

IAR Systems, the future-proof supplier of software tools and services for embedded development, is today proud to announce its further expansion in Asia with the opening of an office in India.

Chiplets Promise to Help Reinstate Moore’s Law and Generate Nearly $6 Billion in Semiconductor Revenue by 2024

Moore’s Law may not be dead, but at 55 years old, it’s certainly feeling its age, with the pace of semiconductor manufacturing advancement decelerating in recent years.

Featured Products