Synopsys, Inc. today announced that its 3DIC Compiler solution enabled Samsung Foundry to design, implement and tape out a complex 5-nanometer SoC featuring eight high-bandwidth memories (HBMs) in a single package.
Packaging
Lattice CrossLink-NX FPGA Wins 2020 EM Best of Industry Award
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, announced the Lattice CrossLink-NX FPGA for embedded vision and AI applications won the Best FPGA Award in the Technology & Product Innovation category at the 2020 EM Best of Industry Awards.
Cobham Advanced Electronic Solutions Launches Industry’s Highest Density NAND Flash Memory Module for Space Applications
Cobham Advanced Electronic Solutions today announced the industry’s highest density NAND flash memory device for a range of demanding space applications.
First Multi-Zone Time-of-Flight Sensor Headlines STMicroelectronics Technology Powering Samsung Flagship Galaxy Note20 Ultra Phones
STMicroelectronics revealed that the newly unveiled Samsung Galaxy Note20 Ultra uses top-notch ST sensing and control technology, enhancing the smartphones’ high-end features while squeezing every watt from the power budget with minimal noise and package size.
Palomar Technologies and Fraunhofer IISB Form Research Initiative on Power Modules for Electric Vehicles
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, and the Fraunhofer Institute for Integrated Systems and Device Technology IISB in Erlangen, Germany, announced their joint research initiative in the area of high-quality, void-free power module packaging for electric vehicles.
The Chip Warriors: A Podcast Documentary Series
America won the first cold war by outspending the Soviet Union in nuclear weapons. Many observers believe the US is engaged in a new cold war – with China. If true, it will be fought with technologies like 5G, artificial intelligence and semiconductors – but this time the US is being outspent.
Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning for 2µm Chiplet Scaling
Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC Engineering to join its new AP Live Network.
EV Group Addresses Key Process Gap in Heterogeneous Integration with Collective Die-to-Wafer Hybrid and Fusion Bonding Demonstration
This breakthrough, which was demonstrated at EVG’s Heterogeneous Integration Competence Center, represents an important milestone in accelerating the deployment of heterogeneous integration (HI) in next-generation 2.5D and 3D semiconductor packaging.
Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES for 22FDX Platform, Targeting IoT and AI
DIALOG SEMICONDUCTOR and GLOBALFOUNDRIES today announced that they have entered into an agreement in which Dialog licenses its Conductive Bridging RAM (CBRAM) technology to GLOBALFOUNDRIES.
Synopsys and Samsung Foundry Announce Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design for Automotive Applications
Synopsys, Inc. and Samsung Foundry today announced the release of a validated automotive reference flow to streamline SoC hardware design for in-system test, implementation, verification, timing and physical signoff for ISO 26262 compliance.
