A*STAR’s Institute of Microelectronics (IME) has collaborated with leading industry players to establish 300mm Wafer Level Package development line (WLP-DL) to drive the application of fan-out wafer level packaging (FOWLP) for achieving innovations in current and next generation system-in-package (SiP).
Packaging
Second Quarter 2020 Global Semiconductor Equipment Billings Up 26% Year-Over-Year, SEMI Reports
Second quarter 2020 global billings for semiconductor manufacturing equipment jumped 26% year-over-year and 8%, to US$16.8 billion, from the first quarter of the year, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Wafer Level Packaging Reaches New Heights
Fan-out package revenue is expected to surpass $2B by 2025 and fan-in WLCSP revenue to peak to $3B by 2025 as TSMC continues to drive the fan-out market in 5G applications.
Tachyum Opens U.S., EU and NATO Government Business Unit
Tachyum Inc. today announced it is opening a business unit to serve U.S., EU and NATO member Government customers of its Prodigy Universal Processor for demanding HPC, artificial intelligence and machine learning workloads.
Lattice Expands CrossLink-NX FPGA Family of Best-in-Class Low Power FPGAs for Smart and Embedded Vision Systems
CrossLink-NX FPGAs deliver the best-in-class low power consumption, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for compute, industrial, automotive, and consumer markets.
TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is driven by use in mobile devices such as smartphones and smartwatches, automotive radar, and increasing adoption in high-performance computing.
Memory in a Metal, Enabled by Quantum Geometry
The emergence of artificial intelligence and machine learning techniques is changing the world dramatically with novel applications such as internet of things, autonomous vehicles, real-time imaging processing and big data analytics in healthcare.
ZEISS Adds Advanced Reconstruction Intelligence to 3D Non-destructive X-ray Imaging for Improved Semiconductor Package Failure Analysis
ZEISS today introduced the Advanced Reconstruction Toolbox for its industry-leading Xradia Versa series of non-destructive 3D X-ray microscopes (XRM) and its Xradia Context 3D X-ray micro-computed tomography (microCT) systems.
KIOXIA Launches First PCIe Gen4 NVMe U.3 SSDs for HPE Servers
KIOXIA America, Inc., is the first1supplier to launch PCIe Gen4 NVM Express (NVMe) data center-class solid-state drives (SSDs) within the HPE NVMe mainstream performance SSD portfolio available on HPE ProLiant, HPE Synergy and HPE Apollo servers.
Changes to Bosch Rexroth Management in North America
Paul Cooke, President and CEO of Bosch Rexroth North America, based in Charlotte, NC, USA,…
