Packaging

Toshiba’s 80V N-channel Power MOSFETs Fabricated with Latest Generation Process Help Improve Power Supply Efficiency

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has added 80V N-channel power MOSFETs to its “U-MOS X-H series” fabricated with the latest generation process. The new MOSFETs are suitable for switching power supplies in industrial equipment used in data centers and communication base stations.

Worldwide Server and Enterprise Storage Systems Markets Will Decline in 2020, Impacted by the COVID-19 Pandemic, According to IDC

End user spending on IT infrastructure (server and enterprise storage systems) will decline in 2020 as a result of the widespread coronavirus pandemic. According to the International Data Corporation (IDC) Worldwide Quarterly Server Tracker and Worldwide Quarterly Enterprise Storage Systems Tracker, under the current probable scenario server market revenues will decline 3.4% year over year to $88.6 billion and external enterprise storage systems (ESS) revenues will decline 5.5% to $28.7 billion in 2020.

New Fabrication Approach Paves Way to Low Cost Mid-Infrared Lasers Useful for Sensing

For the first time, researchers have fabricated high-performance mid-infrared laser diodes directly on microelectronics-compatible silicon substrates. The new lasers could enable the widespread development of low-cost sensors for real-time, accurate environmental sensing for applications such as air pollution monitoring, food safety analysis, and detecting leaks in pipes.

Juniper Research: Coronavirus to Cause $42 Billion Revenue Gap in Global Consumer Device Shipments over the Next 9 Months

New analysis from Juniper Research found that Coronavirus could cause around a $42 billion revenue gap over the next 9 months for smart device vendors. The analysis examined a number of key device verticals including smartphones, tablets, consumer robotics, smart speakers and smart wearables. Three impact scenarios, low, medium and high, illustrate a range of possible outcomes.

Avnet to Distribute Mipsology’s Breakthrough FPGA Deep Learning Inference Acceleration Software in APAC

Global technology solutions provider Avnet Asia and AI software innovator Mipsology today announced that Avnet will promote and resell Mipsology’s Zebra software platform to its APAC customer base. Zebra removes the technical complexity of FPGAs, making them plug-and-play with exceptionally fast performance.

Intel Donates More Than 1 Million Protective Items For Healthcare Workers In Coronavirus Fight

In response to the COVID-19 pandemic, Intel announced Monday that it will source and donate more than 1 million items of personal protective equipment – masks, gloves and other gear – to healthcare workers.

Reno Sub-Systems First to Market with Multi-Level RF Match for Advanced Semiconductor Manufacturing

Reno Sub-Systems (Reno), a developer of high performance Radio Frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced Velocity™ Multi-level RF matching technology, the first technology that can match process impedance changes in microseconds and match sequential multiple power levels with precision. Benefits of this approach include plasma stability, accurate power delivery, and fast tuning for accelerated processing times. The new technology targets manufacturing nodes at or below 10nm.

Plasma-Therm Adds Systems, Engineering Expertise with the Acquisition of JLS Designs Ltd.

Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, has acquired JLS Designs Ltd., a UK-based supplier of compact plasma systems and custom-designed engineering solutions, company officials announced today.

Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the new release of the Cadence® digital full flow—proven with hundreds of completed advanced-node tapeouts—has been enhanced to further optimize power, performance and area (PPA) results across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI). The flow features multiple industry-first capabilities including unified placement and physical optimization engines plus machine learning (ML) capabilities, enabling design excellence with up to 3X faster throughput and up to 20% improved PPA.

Power Integrations Names Anita Ganti to Its Board of Directors

Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that Anita Ganti will join the company’s board of directors on April 1, 2020. Mrs. Ganti is a seasoned leader in the technology sector, with extensive experience in the analog semiconductor industry. From 2015 to 2019 she served as senior vice president of the product engineering services organization of Wipro Limited.

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