The Coronavirus Disease 2019 (COVID-19) is affecting China and is spreading within East Asia and into Europe and North America. In addition to the human cost of life, the impact of the spread of the virus on the global economy is only beginning to be appreciated and has deep implications for the world’s technology supply chain. A new International Data Corporation (IDC) report, Impact of COVID-19 on the Worldwide Semiconductor Market Forecast (IDC #US46115520), provides IDC’s view on the impact the COVID-19 virus will have on the semiconductor market.
Packaging
IAR Systems Extends Capabilities for Safety-Critical Applications Based on Renesas RX MCUs
IAR Systems®, the future-proof supplier of software tools and services for embedded development, launches a new version of its functional safety edition of IAR Embedded Workbench® for Renesas’ RX Family of microcontrollers (MCUs). This new version adds extended capabilities including IDE features for improved user experience, stack protection and support for the latest C18 and C++17 language standards. In addition, the toolchain now supports the latest RX devices including the…
ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT
ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced that its SIC118xKQ SCALE-iDriver™, a high-efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features.
CyberOptics Receives New Orders for Memory Module and Micro LED Inspection and Metrology Systems
CyberOptics Corporation® (Nasdaq: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, today announced that it has received orders valued at approximately $2.8 million for its 2D MX600™ system for post-singulation inspection of memory modules. CyberOptics presently anticipates that these orders will become revenue in the third quarter of 2020.
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
The HiScroll models from Pfeiffer Vacuum’s new range of scroll pumps are oil-free, hermetically sealed vacuum pumps with high nominal pumping speeds of 6 to 20 m³/h. The new pumps are characterized by their compact design and quiet, low-vibration operation (<47 dB[A], and <42 dB[A] in stand-by mode).
Ranovus Announces a Strategic Collaboration with IBM, TE Connectivity and Senko Advanced Components
Ranovus Inc. (“RANOVUS”) today announced a strategic collaboration with IBM Inc. (“IBM”), TE Connectivity (“TE”) and Senko Advanced Components, Inc (“SENKO”), leading providers of multi-terabit interconnect solutions, to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry.
Olympus Supports FMC/TFM Training with OmniScan X3 Flaw Detectors
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, is delivering new OmniScan X3 phased array flaw detectors with FMC/TFM to the University of Ultrasonics to support their advanced training courses.
