Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, is delivering new OmniScan X3 phased array flaw detectors with FMC/TFM to the University of Ultrasonics to support their advanced training courses.
Packaging
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Synopsys, Inc. (Nasdaq: SNPS) today announced the release of a major update to Simpleware™ ScanIP software, which extends its capabilities for segmenting anatomical regions through a new module, Simpleware AS Ortho (Auto Segmenter for Orthopedics). This new product offering is a machine learning (ML)-based auto segmentation module that builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.
Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
Park Systems Announces $1 Million Dollar Nano Research Grant Fund for Researchers Setting up Nanoscience Labs in North America
Park Systems, world-leading manufacturer of Atomic Force Microscopes, announces a $1 Million Dollar Nano Research Grant Fund to support researchers who are starting new nanoscience labs in North America. The Park Systems Nano Research Grant Fund provides up to twenty grants of $50,000 towards the purchase of any AFM system and accessories manufactured by Park Systems.
Transistor Count Trends Continue to Track with Moore’s Law
Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.
SkyWater Chosen by Applied Novel Devices (AND) to Produce New High-Performance Si Power MOSFETs
SkyWater Technology, the innovator’s trusted foundry partner, and Applied Novel Devices Inc, a designer, developer and supplier of novel semiconductor device technologies (“AND”), today announced the companies have entered into a licensing and manufacturing agreement to offer an improved standard process flow for Si power MOSFETs (metal oxide semiconductor field-effect transistors).
Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model
The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a Virtual Conference
Due to concerns over the global coronavirus (COVID-19) outbreak, the management committee and board of directors of the 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, has decided to hold IRPS 2020 as a virtual conference.
CyberOptics Launches 3D MX3000 Final Vision Inspection (FVI) System for Memory Modules
CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression (MRS)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.
Western Digital Announces Appointment of David Goeckeler as Chief Executive Officer
Western Digital Corp. (NASDAQ: WDC) today announced that David Goeckeler has been appointed chief executive officer and a member of the Western Digital Board of Directors (“the Board”), effective March 9, 2020. Mr. Goeckeler currently serves as executive vice president and general manager of Cisco’s $34 billion Networking and Security Business. Mr. Goeckeler succeeds Steve Milligan, who previously announced his intended retirement.
