TopLine Corporation announces the introduction of braided solder columns as a drop-in replacement for solder spheres used in Ball Grid Array (BGA) components.
Packaging
NY CREATES and Korea’s National Nano Fab Center Announce Research Partnership to Develop Joint Technology Hub
NY CREATES and the National Nano Fab Center announced a partnership which aims to develop a shared hub for enabling joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s respective high-tech ecosystem.
IDTechEx Summarizes the Emerging Adoption and Future Trends of SiC and GaN in EVs
In 2008, the commercialization of the silicon carbide (SiC) MOSFET marked a major turning point for the power semiconductor market, representing its first significant development in decades.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
High-end O-Rings to Grow 2x Faster than Wafer Starts
FFKM O-Rings remains low-risk pathway for semiconductor manufacturing.
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX).
Soitec Extends Partnership with UMC
Soitec (Euronext Paris) today announced the expansion of its partnership with UMC, a global semiconductor foundry company, to bring to the market the industry’s first 3D IC solution for Radio Frequency Silicon-on-Insulator (RF-SOI) technology for the 5G era.
Alphawave Semi Expands Partnership with Samsung Foundry
Alphawave Semi has announced the expansion of its strategic partnership with Samsung Foundry, one of the world’s leading advanced semiconductor manufacturers.
Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test
Tadayon to accelerate ecosystem development and scalability for high-volume delivery of in-package optical I/O for next-generation AI systems.
SEMI Applauds New Legislative Solution to Address Gap in U.S. CHIPS Act Notice of Funding Opportunity
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, issued the following statement from Joe Stockunas, President of SEMI Americas.
