According to a recent study from market research firm Global Market Insights, the advanced packaging market is set to grow from its current market value of more than $25 billion to over $40 billion by 2026, gaining remarkable traction over the 2020 to 2026 period.
Packaging
Photonic IC Market Is Expected To Exhibit A CAGR Of 42.6% During The Forecast Period Of 2020-2027
A photonic integrated circuit (IC) is a device that integrates two or more photonic functions similar to an electronic integrated circuit. Photonic ICs are used in fiber-optic communications to multiplex and demultiplex Wavelength Division Multiplex (WMD) carrier signals.
Tektronix Introduces S530 Series Parametric Test System with KTE 7 Software to Support Wide Bandgap (WBG) Fabrication
Tektronix, Inc., a worldwide provider of test and measurement solutions, today released the new Keithley S530 Series Parametric Test System with KTE 7 software and other enhancements.
Global Semiconductor Sales Increase 4.9 Percent Year-to-Year in August
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors were $36.2 billion in August 2020, 4.9 percent more than the August 2019 total of $34.5 billionand 3.6 percent higher than the July 2020 total of $35.0 billion.
Five Trends That Will Shape the Future Semiconductor Technology Landscape
Is Moore’s Law still alive, and which applications will benefit from ultra-scaled technologies? How will data centers cope with the overwhelming amount of data? And will we be able to break the memory wall in traditional Von Neumann computing architectures?
Arm Spins-out Cerfe Labs to Advance Development of CeRAM Memory Technology
Today, Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs).
Thomas L. Deitrich Joins the ON Semiconductor Board of Directors
ON Semiconductor Corporation today announced that Thomas L. Deitrich was appointed to its board of directors.
Intel Wins US Government Advanced Packaging Project
The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.
Busch Innovation in Vacuum Award Goes to Dilo
Dilo Armaturen und Anlagen GmbH has received the “Busch Innovation in Vacuum Award” from Busch Vacuum Solutions. The prize commends Dilo’s pioneering work in handling gases.
Palomar Technologies New 8100 Wire Bonder Increases Productivity and Efficiency
Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the availability of their new Palomar 8100 Wire Bonder.
