Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will acquire buildings and land from Sharp Fukuyama Semiconductor Co., Ltd., a wholly owned subsidiary of Sharp Corporation located in Fukuyama, Hiroshima Prefecture, Japan.
Packaging
COVID-19 Triggers Accelerated Shift to Digital Technologies and Services
The ongoing digital transformation of business and society has been shifted into overdrive by the COVID-19 pandemic, triggering major changes in key segments ranging from online services, to capital spending, to the cloud, to the electronics supply chain.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.
Xperi and Tower Semiconductor Announce New License for 3D Stacked Image Sensor Technology
Xperi Holding Corporation and Tower Semiconductor, a global leader in high-value analog semiconductor foundry solutions, today announced Tower’s license of Invensas ZiBond and DBI 3D semiconductor interconnect technologies.
StratEdge Expands Production Capacity of its RF Packaging Line
StratEdge Corporation announces the expansion of its production line for building ceramic and molded ceramic packages to support 5G infrastructure demands.
Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports
2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion.
Advanced Manufacturing Facility Driving Innovation in High-Performance Electronics Unveiled by Benchmark and Arizona Government Leaders
Benchmark (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today held a virtual grand opening of its new advanced electronics manufacturing facility in Phoenix. Benchmark’s President and CEO Jeff Benck hosted the live webcast and was joined virtually by several dignitaries including Arizona Governor Doug Ducey and Phoenix Mayor Kate Gallego.
Business Confidence in IT Spending Declines Despite Moves to Ease Economic Lockdown, According to IDC COVID-19 Tech Index
Business confidence levels declined in the last week of May, according to the latest update to the IDC COVID-19 Tech Index. IT buyers in the US, Western Europe, and some parts of Asia/Pacific indicated that they now expect total IT spending to decline by more than previously anticipated. This is in spite of a general stabilization in other market indicators over the past month, as many countries prepare to tentatively move into a gradual recovery phase.
IAR Systems Launches Support for the RISC-V P Extension for Packed-SIMD Instructions
IAR Systems, the future-proof supplier of software tools and services for embedded development, today announces initial support for the draft RISC-V P extension in its powerful development tools IAR Embedded Workbench for RISC-V.
