Packaging

Siemens Acquires Avatar, Expands EDA Footprint with Innovative Place and Route Technology

Siemens has signed an agreement to acquire Santa Clara, CA-based Avatar Integrated Systems Inc., a leading developer of place and route software for integrated circuit (IC) design. Avatar helps engineers optimize power, performance, and area (PPA) for complex chips with fewer resources.

Micron Drives DDR5 Adoption With Technology Enablement Program

Micron Technology, Inc. (Nasdaq: MU), today announced a comprehensive enablement program which will provide early access to technical resources, products and ecosystem partners. The Technology Enablement Program will aid in the design, development and qualification of next-generation computing platforms that use DDR5, the most technologically advanced DRAM available.

SEMICON Taiwan 2020 on Schedule as First Comprehensive Virtual and On-Site Event

Current and emerging smart applications in 5G, medtech and artificial intelligence (AI) that are transforming the way we work and live and have helped the world battle the COVID-19 pandemic will take center stage at SEMICON Taiwan 2020.

Keysight Expands Scienlab Charging Discovery Systems Portfolio

Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, has expanded the company’s Scienlab Charging Discovery System (CDS) portfolio with two new test and certification solutions for charging interfaces within an electric vehicle (EV) or electric vehicle supply equipment (EVSE).

Analog Devices Announces Combination with Maxim Integrated, Strengthening Analog Semiconductor Leadership

Analog Devices, Inc. and Maxim Integrated Products, Inc. today announced that they have entered into a definitive agreement under which ADI will acquire Maxim in an all stock transaction that values the combined enterprise at over $68 billion.

Presto Engineering Moves to New Facility in Caen for Enhanced Engineering and Production Capabilities

Presto Engineering, an ASIC design and outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today the grand opening of its new Caen Hub in France. The facility will provide IC test, qualification, and test production services primarily for communications, automotive, IoT, and industrial applications.

New Materials for Extra Thin Computer Chips

For a long time, something important has been neglected in electronics: If you want to make electronic components smaller and smaller, you also need the right insulator materials.

ESD Alliance Reports Electronic Design Automation Industry Revenue Growth for Q1 2020

The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) today announced that the Electronic Design Automation (EDA) industry revenue increased 3.5 percent in Q1 2020 to $2,698 million, compared to $2,606.4 million in Q1 2019. The four-quarter moving average, which compares the most recent four quarters to the prior four quarters, increased by 5.2 percent.

Traditional PC Shipments Continue to Grow Amid Global Economic Slowdown, According to IDC

The second quarter of 2020 (2Q20) ended well for the Traditional PC market, comprised of desktops, notebooks, and workstations, with global shipments growing 11.2% year over year reaching a total of 72.3 million units.

Renesas Unveils Integrated LIN Interface Sensor Signal Conditioner for Electric and Hybrid Electric Vehicle HVAC Systems

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today introduced the ZSSC4132 – an automotive pressure sensor solution featuring an integrated certified LIN v2.2a interface.

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