GLOBALFOUNDRIES today announced it has secured a purchase option agreement for approximately 66 acres of undeveloped land adjacent to its most advanced manufacturing facility, Fab 8, in Malta, N.Y., near the Luther Forest Technology Campus (LFTC).
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Semtech Announces Production of New Tri-Edge, a PAM4 CDR Platform for 200G and 400G Data Center Applications
Semtech Corporation (Nasdaq: SMTC), a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, today announced production availability of GN2558 and GN2559, Semtech’s Tri-Edge CDR SR solutions to enable next-generation data center multi-mode interconnectivity.
CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.
SEMI Virtual Summit Focuses on Microtechnology-Enabled Solutions to Healthcare Challenges
The latest healthtech innovations driven by microelectronics will be presented at the SEMI Virtual Healthtech Summit, Europe’s first online event to explore the critical role of semiconductors in solving the world’s most pressing healthcare challenges including COVID-19. Registration is open for the July 16, 2020, summit.
North American Semiconductor Equipment Industry Posts May 2020 Billings
North America-based manufacturers of semiconductor equipment posted $2.35 billion in billings worldwide in May 2020 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published by SEMI.
Call for SEMICON West 2020 “Best of West” Award Applications
SEMI today began accepting SEMICON West 2020 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
Automotive IC Market Forecast With Strongest CAGR Through 2024
IC Insights released its June Update to the 2020 McClean Report earlier this month. This Update included a 2018-2024 IC database that segmented the IC market by major product type including Consumer, Auto, Computer, Industrial, Communications, and Government/Military end-use applications in the Americas, Europe, Japan, China, and Asia-Pacific regions.
QuickLogic Announces Open Reconfigurable Computing Initiative
QuickLogic Corporation today announced its ground breaking QORC (QuickLogic Open Reconfigurable Computing) initiative, making it the first programmable logic vendor to actively embrace a fully open source suite of development tools for its FPGA devices and eFPGA technology.
Dow Introduces Easy-to-Dispense Gap Filler with Strong Thermal Conductivity and Slump Resistance for Efficient Assembly
Dow introduced today new DOWSIL TC-4040 Dispensable Thermal Pad, a thermal interface material (TIM) that is easy to dispense, resists slumping and provides strong thermal conductivity, a key property in 5G designs with higher heat caused by greater power densities.
GaN Systems Announces Sixth Annual “GaN Systems Cup” China Power Supply Society Design Competition
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, is proudly sponsoring the distinguished China Power Supply Society (CPSS) design competition, which focuses on innovation in energy conservation, emission reduction, and new energy utilization.
