NXP Semiconductors N.V. (NASDAQ: NXPI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform.
Packaging
SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.
The bipartisan legislation would improve the competitiveness of semiconductor research, design and manufacturing in the United States, resulting in the creation of thousands of new jobs and bolstering national security.
Minimizing Thermal Conductivity of Crystalline Material with Optimal Nanostructure
Towards application of materials informatics to development of thermal functional materials.
Gartner Forecasts Worldwide Device Shipments to Decline 14% in 2020 Due to Coronavirus Impact
Global shipments of devices (PCs, tablets and mobile phones) are on pace to decline 13.6% in 2020, totaling 1.9 billion units, according to the latest forecast from Gartner, Inc.
Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology.
CMOS Image Sensors to Resume Record Run in 2021
The fallout from the Covid-19 virus crisis in 2020 is expected to lower CMOS image sensor sales for the first time in 10 years, but new record-high revenues are seen next year, says new O-S-D Report.
Mitsubishi Electric to Acquire Factory to Expand Power Device Business
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will acquire buildings and land from Sharp Fukuyama Semiconductor Co., Ltd., a wholly owned subsidiary of Sharp Corporation located in Fukuyama, Hiroshima Prefecture, Japan.
COVID-19 Triggers Accelerated Shift to Digital Technologies and Services
The ongoing digital transformation of business and society has been shifted into overdrive by the COVID-19 pandemic, triggering major changes in key segments ranging from online services, to capital spending, to the cloud, to the electronics supply chain.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements
SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
Renesas Unveils RZ/V Microprocessor Series with Vision-Optimized Artificial Intelligence Accelerator
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced the RZ/V series of microprocessors (MPUs), which features DRP-AI (Dynamically Reconfigurable Processor), Renesas’ exclusive vision-optimized artificial intelligence (AI) accelerator.
