The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced key advancements and activities designed to enhance advanced driver assistance systems (ADAS), autonomous driving systems (ADS) and other automotive applications. Trends such as the proliferation of camera, display, radar, lidar and other sensors are creating growing demand for high-performance wired interfaces in vehicles. While drawing on its existing specifications for mobile devices, MIPI is developing and enhancing automotive specifications to meet the stringent requirements of automotive OEMs, Tier 1 suppliers, SoC designers and other industry providers in areas such as reliability, functional safety and low electromagnetic interference (EMI).
Packaging
Synopsys Announces Industry-First Unified Functional Safety Verification Solution to Accelerate Time-to-Certification for IPs and SoCs
Synopsys, Inc. (Nasdaq: SNPS) today announced the industry’s first and most comprehensive unified functional safety verification solution to accelerate time to ISO 26262 certification for automotive IP and semiconductor companies targeting the highest Automotive Safety Integrity Levels (ASIL D). As part of the solution, Synopsys introduced VC Functional Safety Manager, a FMEA/FMEDA and fault classification automation technology enabling architects, IP designers, and verification engineers to accelerate their functional safety verification with productivity gains up to 50 percent compared to traditional manual and error-prone functional safety verification point tools.
Groundbreaking Method Detects Defective Computer Chips
Guaranteeing that computer chips, that can consist of billions of interconnected transistors, are manufactured without defects is a challenge. But how to determine if a chip is compromised? Now a technique co-developed by researchers at the Paul Scherer Institut in Switzerland and researchers at the USC Viterbi School of Engineering would allow companies and other organizations to non-destructively scan chips to ensure that they haven’t been altered and that they are manufactured to design specifications without error.
2019 IEEE International Electron Devices Meeting to Shine the Spotlight on the Latest Advances in Semiconductors and Related Technologies
“Innovative Devices for an Era of Connected Intelligence” is the theme of the upcoming 2019 IEEE International Electron Devices Meeting (December 7-11, 2019), chosen to reflect the conference’s focus this year on the processors, memories, 3D architectures, power devices, quantum computing concepts and other technologies needed to drive diverse new applications of electronics technology forward. The 65th annual IEDM will feature a technical program of 238 papers given by many of the world’s top scientists and engineers in the field. It will be preceded by a series of 90-minute tutorials on Saturday, Dec. 7, and by day-long short courses on Sunday, Dec. 8.
Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Synopsys Completes Acquisition of QTronic GmbH
Synopsys, Inc. (NASDAQ: SNPS) today announced it has completed its acquisition of QTronic GmbH, a leader in simulation, test tools, and services for automotive software and systems development headquartered in Germany. QTronic simulation and test tools will accelerate Synopsys delivery of a comprehensive automotive virtual prototyping solution for system and software development throughout the automotive electronic supply chain.
New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for MIPI-based Embedded Vision Systems
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on panel display performance, and flexible on-device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications.
Global Market Remains Strong for ALD & CVD Precursors in IC Fabs
TECHCET—the advisory services firm providing electronic materials information— announced that the global market for atomic layer deposition (ALD) and chemical vapor deposition (CVD) precursors is showing strong growth despite semiconductor fabrication market challenges in 2019.
Toshiba Memory Today Rebrands As “Kioxia”
Kioxia Holdings Corporation, formerly Toshiba Memory Holdings Corporation, today announced that it is officially operating under its new corporate identity, effective immediately.
