Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in…
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Renesas Electronics and StradVision Collaborate on Smart Camera Development for Next-Generation ADAS
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and StradVision, Inc., a vision processing technology solutions provider for autonomous vehicles with expertise in deep learning, today announced the joint development of a deep learning-based object recognition solution for smart cameras used in next-generation advanced driver assistance system (ADAS) applications and cameras for ADAS Level 2 and above.
Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
Synopsys, Inc. today announced a collaboration with TSMC to develop a broad portfolio of DesignWare interface IP, logic libraries, embedded memories, and one-time programmable (OTP) non-volatile memory (NVM) IP on TSMC’s 5-nanometer (nm) FinFET Plus (N5P) Process. This collaboration reinforces the longstanding relationship between the two companies to provide designers with the high-quality IP needed to lower risk, differentiate their system-on-chips (SoCs), and accelerate their time-to-market.
Toshiba Memory America Introduces Next-Gen Serial Interface NAND
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new family of SLC NAND flash memory products for embedded applications. Compatible with the widely used Serial Peripheral Interface (SPI), Toshiba Memory’s second-generation Serial Interface NAND can be used in a wide range of consumer and industrial applications that require high-speed data transfers, including flat screen TVs, printers, wearable devices, and robots.
Achronix Joins TSMC IP Alliance Program
Achronix Semiconductor Corporation, a provider in FPGA-based hardware accelerator devices and high-performance eFPGA IP, has joined the TSMC IP Alliance Program, a key component of TSMC Open Innovation Platform® (OIP). Achronix’s award-winning Speedcore eFPGA IP is optimized for high-end and high-performance applications. Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC).
Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor
Samsung Electronics Co., Ltd. today introduced the industry’s first 0.7-micrometer (μm)-pixel image sensor, the 43.7-megapixel (Mp) Samsung ISOCELL Slim GH1. Thanks to advanced ISOELL Plus technology, the new ultra-high-resolution GH1 image sensor embraces 43.7-million 0.7μm-sized pixels in a super-small package, providing the optimum solution for slim full-display devices.
Bottom-Up Synthesis of Crystalline 2D Polymers
Scientists at the Center for Advancing Electronics Dresden (cfaed) at TU Dresden have succeeded in synthesizing sheet-like 2D polymers by a bottom-up process for the first time. A novel synthetic reaction route was developed for this purpose. The 2D polymers consist of only a few single atomic layers and, due to their very special properties, are a promising material for use in electronic components and systems of a new generation. The research result is a collaborative work of several groups at TU Dresden and Ulm University and was published this week in two related articles in the scientific journals “Nature Chemistry” and “Nature Communications”.
Revolutionizing Wafer Testing to Bring New Technologies to Market
Nearly every new technology breakthrough in the semiconductor industry targets high volume manufacturing and comes with its unique specificities. This results in challenges for engineers to manufacture and test new integrated circuits (ICs) on the wafer.
MagnaChip Targets Fast-Growing e-Bike Market with High-Performance MOSFET
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the release of a 100V Mid-Voltage MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) with a new thermal package (“M2PAK-7P”) designed for the fast-growing e-Bike market. This MOSFET with M2PAK-7P is suitable to meet the particular requirements of electric bike (e-Bike) systems. E-Bikes, an emerging trend especially with electric scooters, have…
Tachyum Joins Intel, AMD, and nVidia With New Headquarters in Santa Clara
Tachyum, a semiconductor startup and developer of the world’s first Universal Processor platform, today announced the opening of its new, larger corporate headquarters in Santa Clara to better accommodate the rapidly growing number of customers, partners, vendors and its growing personnel ranks. The new offices are located at 2520 Mission College Blvd, Suite 201, Santa Clara CA 95054. Tachyum’s new facilities will better enable the company to finish development, start marketing and selling its disruptive products that tackle the most pressing global issues in data centers, AI, telecommunications, edge computing and mobility today.
