Packaging

Heilind Electronics and Laird Performance Materials Sign Global Distribution Agreement

Heilind Electronics, a leading distributor of electronic components, announced today the signing of a global distribution agreement with Laird Performance Materials, a portfolio company of privately held Advent International.

Pfeiffer Vacuum Supplies Turbopumps for GANIL Large-Scale Research Facility in France

Pfeiffer Vacuum has received several major orders from the French large-scale research facility GANIL (Grand Accélérateur National d’Ions Lourds) (National Large Heavy Ion Accelerator) for the supply of turbopumps and custom vacuum chambers.

MIPI RFFE v3.0 Delivers Tighter Timing Precision and Reduced Latencies Needed for Successful 5G Rollouts

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI RF Front End Control Interface (MIPI RFFE) v3.0. The latest version of the world’s de facto standard interface for control of radio frequency (RF) front-end (FE) subsystems, MIPI RFFE v3.0 is designed to deliver the tighter timing precision and reduced latencies that manufacturers need today to advance the rollout of 5G around the world.

Nordson Corporation Names Joseph P. Kelley as Chief Financial Officer

Nordson Corporation (NASDAQ-NDSN) today announced that Joseph P. Kelley has been named Executive Vice President and Chief Financial Officer, effective July 6, 2020. Mr. Kelley succeeds Gregory A. Thaxton, who previously announced his plans to retire. Upon Mr. Kelley’s start date, Mr. Thaxton will become Executive Vice President to the Company until he retires on August 28, 2020.

Global Semiconductor Sales Decrease 3.6 Percent in First Quarter of 2020

First-quarter sales decreased 3.6 percent compared to the previous quarter, which is in line with typical seasonal trends, and increased 6.9 percent compared to the first quarter of 2019.

STMicroelectronics Helps Meet Functional-Safety Norms with Certified Software for STM32 and STM8 Families

STMicroelectronics has released three functional-safety packages that simplify development of safety-critical industrial, medical, consumer and automotive products based on STM32 and STM8 microcontrollers and microprocessors.

Vacuum Systems for the Treatment of COVID-19 Patients in Brazil

Brazil currently has the most confirmed COVID-19 cases in South America. Already in March, hospital capacities for intensive medical care of corona patients were expanded, and several field hospitals were established.

Aldec’s New HES FPGA Accelerator Board Targets HPC, HFT and Prototyping Applications plus Hits the ‘Price/Performance’ Sweet Spot

Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a new FPGA accelerator board for high performance computing (HPC), high frequency trading (HFT) applications and high speed FPGA prototyping.

Synopsys Introduces 3DIC Compiler, Industry’s First Unified Platform to Accelerate Multi-die System Design and Integration

Synopsys, Inc. (Nasdaq: SNPS) today introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an unprecedented fully integrated, high-performance, and easy-to-use environment, offering architectural exploration, design, implementation, and signoff with signal, power, and thermal integrity optimizations, all in one solution.

SiFive Joins Open COVID Pledge to Fight Global Pandemic

SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced…

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