Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced development of the first standards-based prototype of a new type of SSD that features extensive scalability, unmatched durability and CPU-relieving functionality.
Packaging
New Insulation Technique Paves The Way For More Powerful and Smaller Chips
Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips.
300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023
300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.
The Quantum Computing Market Is Poised for Strong Growth with Global Revenue to Reach $9.1 Billion by 2030
The global market for quantum computing is being driven largely by the desire to increase the capability of modeling and simulating complex data, improve the efficiency or optimization of systems or processes, and solve problems with more precision.
Intel Lays Cornerstone for Mobileye’s New Global Development Center in Jerusalem
Mobileye President and CEO Prof. Amnon Shashua and Israeli Prime Minister Benjamin Netanyahu laid the cornerstone for Mobileye’s new global development center in Jerusalem on Tuesday, Aug. 27, 2019.
Toshiba Memory to Acquire the SSD Business of Taiwan’s LITE-ON Technology
Toshiba Memory Holdings Corporation, which will rebrand as Kioxia Holdings Corporation on October 1, 2019, announced today that it has signed a definitive agreement with LITE-ON Technology Corporation to acquire its Solid State Drive (SSD) business.
Intel Updates Advanced Packaging Technologies at Semicon West, the Latest in a Decade (or more) Evolution
In the last several years, Intel has had a series of announcements in the packaging arena, focused on the integration of multiple styles of chips in the same package to improve performance and broaden system capabilities.
Intel Optane DC Persistent Memory Improves Search, Reduces Costs in Baidu’s Feed Stream Services
Intel today announced Baidu is architecting the in-memory database of its Feed Stream services to harness the high-capacity and high-performance capabilities of Intel Optane DC persistent memory.
KLA Joins Automotive Electronics Council
KLA Corporation announced today that the Automotive Electronics Council (AEC), the organization that sets qualification standards for electronic components in the automotive industry, has accepted the company as an associate member.
GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
Injunctions seek to prevent unlawful importation of infringing Taiwanese semiconductors.
