The upcoming 65th annual IEEE International Electron Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square hotel, will once again feature the latest and most important research taking place in semiconductors and other electron devices, but with a sharper focus this year on devices intended to support diverse new applications.
Packaging
Arm TechCon 2019: Showcasing the New Era of Total Compute
Now in its 15th year, Arm® TechCon 2019, will explore three emergent technologies, AI, 5G, and a secure IoT, all of which are converging to enable more meaningful data insights and fuel a shift into the New Era of Total Compute.
Cerebras Systems Unveils the Industry’s First Trillion Transistor Chip
Cerebras Systems, a startup dedicated to accelerating Artificial intelligence (AI) compute, today unveiled the largest chip ever built. Optimized for AI work, the Cerebras Wafer Scale Engine (WSE) is a single chip that contains more than 1.2 trillion transistors and is 46,225 square millimeters.
Stanford Builds a Heat Shield Just 10 Atoms Thick to Protect Electronic Devices
Atomically thin heat shields could be up to 50,000 times thinner than current insulating materials in cell phones and laptops.
Meera Rao Joins Rambus Board of Directors
Rambus Inc., a silicon IP and chip provider making data faster and safer, today announced the appointment of Meera Rao to its Board of Directors, effective immediately.
StratEdge Expands Packaging and Assembly Services for High-Frequency and High-Power Devices
New facility equipped with cleanrooms and latest eutectic die attach systems.
Smart Tech, Innovation, Industry Future in Spotlight at SEMICON Taiwan 2019
Spanning the entire semiconductor and microelectronics supply chain – from design through systems – SEMICON Taiwan 2019 will gather the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data.
Flash Memory Summit Announces 2019 SuperWomen in Flash Leadership Award
Flash Memory Summit (FMS) and the Evaluator Group announced Calline K. Sanchez winner of the SuperWomen in Flash Leadership Award.
MRAM, A Promise Beyond eFlash
Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for eFlash. This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded NVM for code/data storage is needed.
Diodes Incorporated to Acquire Lite-On Semiconductor Corporation
Diodes Incorporated and Lite-On Semiconductor Corporation today announced the companies have entered into an agreement that provides for the acquisition of LSC by Diodes.
