Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology.
Packaging
NY CREATES and TetraMem Forge Strategic Partnership
NY CREATES and TetraMem announced today that their partnership has led to the successful upscaling of TetraMem’s disruptive in-memory computing technologies from a 200mm wafer platform to the 300mm silicon platform, the foundation upon which next-gen AI computer chips are built.
CEA-Leti Reports Three-Layer Integration Breakthrough On the Path for Offering AI-Embedded CMOS Image Sensor
CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor.
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development.
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
Nordson Corporation Announces Agreement to Acquire Atrion Corporation
Nordson Corporation today announced that it has entered into a definitive agreement to acquire Atrion Corporation.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
EV Group Doubles Throughput of Semiconductor Layer Transfer Tech with EVG LayerRelease System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.
NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.
