SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
Packaging
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
Xperi Enters into New Patent and Technology License Agreement with SK hynix
Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. The agreement includes access to Xperi’s broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.
Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services. With this acquisition, Presto adds ASIC design to its suite of services for the Industry 4.0, IoT, and autonomous driving market.
Onto Innovation Announces Multiple Orders to Support 5G Ramp
Onto Innovation Inc. (NYSE: ONTO) announced that it has received orders totaling 15 systems from two leaders in advanced packaging. Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions.
Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure
Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.
A New Wave of Fan-Out Packaging Growth
Key players from different business models are fueling new growth.
2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion
Worldwide silicon wafer area shipments in 2019 declined 7 percent from the 2018 record high while revenue remained above the $11 billion mark despite a global silicon revenue slip of 2 percent over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. Silicon wafer area shipments in 2019 totaled 11,810 million square inches (MSI), while the industry logged shipments of 12,732 million square inches in 2018. Revenues in 2019 totaled $11.15 billion, edging down from the $11.38 billion posted in 2018.
ZEISS Accelerates Semiconductor Package Failure Analysis by Orders of Magnitude with Crossbeam Laser FIB-SEM
ZEISS today introduced the ZEISS Crossbeam Laser — a new family of site-specific focused ion beam scanning electron microscope (FIB-SEM) solutions that accelerate package failure analysis and process optimization for advanced semiconductor packages. Integrating a femtosecond laser for speed, a gallium ion (Ga+) beam for accuracy, and SEM for nanoscale-resolution imaging, the ZEISS Crossbeam Laser family provides package engineers and failure analysts with the fastest cross-section solution at the highest imaging performance, while providing minimal sample damage.
SEMI Postpones SEMICON China, Suspends SEMICON Korea in Response to Coronavirus Outbreak
In accordance with government guidelines and to protect the health and safety of exhibitors and guests, SEMI announced Tuesday the postponement of SEMICON/FPD China 2020 and related events originally scheduled for March 18-20, 2020. SEMI China is actively working on a contingency plan for rescheduling of the event and will keep you informed as soon as a confirmed plan is in place.
