Reno Sub-Systems (Reno), a developer of high performance Radio Frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, today introduced Velocity™ Multi-level RF matching technology, the first technology that can match process impedance changes in microseconds and match sequential multiple power levels with precision. Benefits of this approach include plasma stability, accurate power delivery, and fast tuning for accelerated processing times. The new technology targets manufacturing nodes at or below 10nm.
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Plasma-Therm Adds Systems, Engineering Expertise with the Acquisition of JLS Designs Ltd.
Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, has acquired JLS Designs Ltd., a UK-based supplier of compact plasma systems and custom-designed engineering solutions, company officials announced today.
Cadence Digital Full Flow Optimized to Deliver Improved Quality of Results with Up to 3X Faster Throughput
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that the new release of the Cadence® digital full flow—proven with hundreds of completed advanced-node tapeouts—has been enhanced to further optimize power, performance and area (PPA) results across a variety of application areas including automotive, mobile, networking, high-performance computing and artificial intelligence (AI). The flow features multiple industry-first capabilities including unified placement and physical optimization engines plus machine learning (ML) capabilities, enabling design excellence with up to 3X faster throughput and up to 20% improved PPA.
Power Integrations Names Anita Ganti to Its Board of Directors
Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced that Anita Ganti will join the company’s board of directors on April 1, 2020. Mrs. Ganti is a seasoned leader in the technology sector, with extensive experience in the analog semiconductor industry. From 2015 to 2019 she served as senior vice president of the product engineering services organization of Wipro Limited.
COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC
The Coronavirus Disease 2019 (COVID-19) is affecting China and is spreading within East Asia and into Europe and North America. In addition to the human cost of life, the impact of the spread of the virus on the global economy is only beginning to be appreciated and has deep implications for the world’s technology supply chain. A new International Data Corporation (IDC) report, Impact of COVID-19 on the Worldwide Semiconductor Market Forecast (IDC #US46115520), provides IDC’s view on the impact the COVID-19 virus will have on the semiconductor market.
IAR Systems Extends Capabilities for Safety-Critical Applications Based on Renesas RX MCUs
IAR Systems®, the future-proof supplier of software tools and services for embedded development, launches a new version of its functional safety edition of IAR Embedded Workbench® for Renesas’ RX Family of microcontrollers (MCUs). This new version adds extended capabilities including IDE features for improved user experience, stack protection and support for the latest C18 and C++17 language standards. In addition, the toolchain now supports the latest RX devices including the…
ACM Research Launches Stress-Free Polishing Tool for Advanced Packaging Applications; Delivers First Tool to Leading Chinese OSAT
ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today introduced the Ultra SFP ap tool for advanced packaging solutions. The Ultra SFP ap is designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging (FOWLP), such as copper overburden post-TSV fill and wafer warpage issues that plague FOWLP processes.
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
Power Integrations’ SCALE-iDriver for SiC MOSFETs Achieves AEC-Q100 Automotive Qualification
Power Integrations (Nasdaq: POWI), the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced that its SIC118xKQ SCALE-iDriver™, a high-efficiency, single-channel gate driver for silicon carbide (SiC) MOSFETs, is now certified to AEC-Q100 for automotive use. Devices can be configured to support gate-drive voltage requirements of commonly used SiC MOSFETs and feature sophisticated safety and protection features.
CyberOptics Receives New Orders for Memory Module and Micro LED Inspection and Metrology Systems
CyberOptics Corporation® (Nasdaq: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, today announced that it has received orders valued at approximately $2.8 million for its 2D MX600™ system for post-singulation inspection of memory modules. CyberOptics presently anticipates that these orders will become revenue in the third quarter of 2020.
