The HiScroll models from Pfeiffer Vacuum’s new range of scroll pumps are oil-free, hermetically sealed vacuum pumps with high nominal pumping speeds of 6 to 20 m³/h. The new pumps are characterized by their compact design and quiet, low-vibration operation (<47 dB[A], and <42 dB[A] in stand-by mode).
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Ranovus Announces a Strategic Collaboration with IBM, TE Connectivity and Senko Advanced Components
Ranovus Inc. (“RANOVUS”) today announced a strategic collaboration with IBM Inc. (“IBM”), TE Connectivity (“TE”) and Senko Advanced Components, Inc (“SENKO”), leading providers of multi-terabit interconnect solutions, to create an ecosystem to design and manufacture multi-vendor solutions for Co-Packaged Optics applications in data center.
Everspin Technologies and GLOBALFOUNDRIES Extend MRAM Joint Development Agreement to 12nm
Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive RAM (MRAM), today announced an amendment of its Spin-transfer Torque (STT-MRAM) joint development agreement (JDA) with GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry.
Olympus Supports FMC/TFM Training with OmniScan X3 Flaw Detectors
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, is delivering new OmniScan X3 phased array flaw detectors with FMC/TFM to the University of Ultrasonics to support their advanced training courses.
Synopsys Introduces Machine Learning-Based Auto Segmentation Module for 3D Image Processing
Synopsys, Inc. (Nasdaq: SNPS) today announced the release of a major update to Simpleware™ ScanIP software, which extends its capabilities for segmenting anatomical regions through a new module, Simpleware AS Ortho (Auto Segmenter for Orthopedics). This new product offering is a machine learning (ML)-based auto segmentation module that builds on Synopsys’ ScanIP software, a comprehensive solution for 3D image processing and segmenting images generated by computed tomography (CT) or magnetic resonance imaging (MRI) scanners.
Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices.
Park Systems Announces $1 Million Dollar Nano Research Grant Fund for Researchers Setting up Nanoscience Labs in North America
Park Systems, world-leading manufacturer of Atomic Force Microscopes, announces a $1 Million Dollar Nano Research Grant Fund to support researchers who are starting new nanoscience labs in North America. The Park Systems Nano Research Grant Fund provides up to twenty grants of $50,000 towards the purchase of any AFM system and accessories manufactured by Park Systems.
Transistor Count Trends Continue to Track with Moore’s Law
Though growth rates in some product categories have slowed, doubling of transistors per chip every two years remains a guideline that the industry continues to follow.
SkyWater Chosen by Applied Novel Devices (AND) to Produce New High-Performance Si Power MOSFETs
SkyWater Technology, the innovator’s trusted foundry partner, and Applied Novel Devices Inc, a designer, developer and supplier of novel semiconductor device technologies (“AND”), today announced the companies have entered into a licensing and manufacturing agreement to offer an improved standard process flow for Si power MOSFETs (metal oxide semiconductor field-effect transistors).
Si2 Compact Model Coalition to Support CEA-Leti SPICE Simulation Model
The Si2 Compact Model Coalition has announced the approval and financial support of L-UTSOI, a new ultra-thin, silicon-on-insulator transistor simulation model developed by CEA-Leti, a France-based research institute for electronics and information technologies. L-UTSOI was selected for support by CMC, a coalition of 30 semiconductor companies that standardizes semiconductor models used in a class of circuit simulation tools called SPICE, or Simulation Program with Integration Circuit Emphasis.
