Toshiba Memory Corporation and Western Digital Corp. have finalized a formal agreement to jointly invest in the “K1” manufacturing facility that Toshiba Memory is currently constructing in Kitakami, Iwate Prefecture, Japan.
Packaging
CEA-Leti and Silvaco Team Up on Yield-Prediction Project For Ultra-Low-Power Static Memories
Leti, a research institute of CEA-Tech, and Silvaco Inc., a global provider of software, IP and services for designing chips and electronic systems for semiconductor companies, today announced, during the 56th Design Automation Conference (DAC) in Las Vegas, a project to estimate and model the yield of ultra-low-voltage (ULV), ultra-low-leakage (ULL) static random access memory (SRAM) used in computing applications. Accurate yield prediction in the early stage of the IC design…
Global Semiconductor Alliance Launches Initiative to Bolster Women’s Leadership
The Global Semiconductor Alliance (GSA) today unveiled its Women’s Leadership Initiative (WLI), seeking to significantly increase the number of women entering the semiconductor market, as well as elevating their participation as founders, leaders and board members. As part of this initiative, the GSA has established the WLI Council that will create and implement programs and projects towards meeting the WLI objectives. “The WLI Council is passionate about increasing the number of women in…
CyberOptics to Launch New AVLS3 with CyberSpectrum Software and New NanoResolution MRS Sensor at SEMICON West
CyberOptics® Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone Center in San Francisco, CA. During the show, the company will launch its new WaferSense® Auto Vibration and Leveling Sensor™ (AVLS3) with CyberSpectrum software. Semiconductor fabs and OEMs value the accuracy, precision and versatility of the WaferSense AVLS3 – The most…
Call For SEMICON WEST 2019 “Best Of West” Award Applications
SEMI is accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability. The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form. Best of West award winners will be announced July 10 at SEMICON West 2019, July…
Mentor Certified for Latest TSMC 5nm FinFET Process and TSMC-SoIC 3D Chip Stacking Tech
Mentor, a Siemens business, announced that several tools in its Calibre™ nmPlatform and Analog FastSPICE (AFS™) Platform have been certified on TSMC’s 5nm FinFET process technology. Mentor also announced it has successfully completed reference flow materials in support of TSMC’s innovative System-on-Integrated-Chips (TSMC-SoIC™) multi-chip 3D stacking technology. “Mentor has yet again increased its value to TSMC’s ecosystem by offering more features and solutions in support of our most advanced process,” said Suk…
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
IEEE International Electron Devices Meeting Announces 2019 Call for Papers
The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 7–11, 2019, has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development. The paper submission deadline this year is Friday, July 26, 2019. Authors are asked to submit four-page camera-ready papers. Accepted papers will be published as-is in the proceedings. Only a very small…
Edwards Responds to United Nations’ New Greenhouse Gas Guidelines
The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science related to climate change, released the latest refinement to its 2006 Guidelines. As part of an effort to tackle climate change, the refined regulations tighten control on new greenhouse gases used in semiconductor manufacturing and increase requirements for reporting and accountability for manufacturers. “The IPCC has recognised that there is a gap between the amount…
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…
