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Weebit Nano and Leti File Three New Patents for Improved Yield and Reliability of Advanced ReRAM Products

Weebit Nano (ASX: WBT), the next generation memory technology for the global semiconductor industry, and its development partner Leti, the French research institute recognised as a global leader in the field of micro-electronics, have filed three new patents for Weebit’s Silicon Oxide (SiOx) ReRAM
technology. The latest patents from Weebit and Leti use newly developed smart algorithms to increase the reliability and yield of ReRAM memory cells and enable scalable immune ReRAM process improvements. Two patents identify failure modes, in which optimised smart programming algorithms then improve the window margin and array yield. The third patent improves process flows, allowing increased stability at scaled memory cells in geometries of 40nm and below.

NAND Flash to Lead All Others As IC Market Growth Returns in 2020

IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) through the year 2024. The top five categories for IC product growth are covered in this bulletin.

OneSpin Addresses the Challenges of RISC-V Verification at the Annual RISC-V Summit

OneSpin Solutions, provider of certified IC integrity verification solutions for building functionally correct, safe, secure, and trusted integrated circuits, will showcase its verification expertise of RISC-V processor cores at the upcoming RISC-V Summit being held December 10-12, 2019 at the San Jose Convention Center. OneSpin will host attendees at both its booth and a demo pod in the OpenHW pavilion at the RISC-V Summit, while the company’s experts will present two sessions on verifying RISC-V SoCs.

Boréas Technologies’ New Chip-Scale Haptic IC Drives HD Touch in Smallest Electronics

Boréas Technologies, developer of ultra-low-power haptic technologies, today introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its flagship low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices. Featuring WLCSP packaging, the BOS1901CW is just 2.1×2.2×0.6 mm and consumes just one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices.

SÜSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SÜSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unprecedented array of SUSS MicroTec equipment and fabrication technologies at the doorstep of its North American customer base, readily accessible for demonstrations and evaluations.

Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent

Worldwide semiconductor equipment manufacturers posted third-quarter 2019 billings of US$14.9 billion, a quarter-over-quarter increase of 12 percent but down 6 percent from the third quarter of 2018, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today.

Nordson Corporation Elects Ginger Jones to its Board of Directors

Nordson Corporation (NASDAQ-NDSN) announced the election of Ginger M. Jones to its board of directors, effective today. Ms. Jones has more than 30 years of finance and accounting experience in the manufacturing, industrial and consumer industries. Before retiring in December 2018, Ms. Jones served as the senior vice president and chief financial officer of Cooper Tire & Rubber Company (NYSE: CTB), where she was responsible for financial operations, investor relations and business information systems. Ms. Jones is currently a member of the board of directors of Tronox Holdings plc. (NYSE: TROX) and Libbey Inc (NYSE: LBY). She is chair of the audit committee and a member of the compensation committee for both boards.

Analog Devices Appoints Dr. Susie Wee to Board of Directors

Analog Devices, Inc. (Nasdaq: ADI) today announced the appointment of Dr. Susie Wee to the Board of Directors as an independent director, effective November 29, 2019. Dr. Wee is the Senior Vice President and General Manager of DevNet and CX Ecosystem Success at Cisco Systems and will serve on the Board’s Compensation Committee. At Cisco, Dr. Wee leads the DevNet and CX Ecosystem Success group, which is building the ecosystem of customers, partners, IT professionals, and software developers who innovate with Cisco platforms. She also oversees Cisco’s professional training and certification program and founded and leads DevNet, the company’s developer program.

Samsung Receiving Industry’s First Global Recognition for Environmental Sustainability of its Semiconductor Solutions

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, announced that its 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) 3.0 will be awarded Carbon Footprint and Water Footprint Certifications from the highly respected UK-based Carbon Trust during a ceremony at the British Embassy in Seoul, Korea later today. Samsung’s 512GB eUFS 3.0 is the first mobile memory in the industry to be recognized by an international certifying organization, which was made possible through the company’s extensive efforts to reduce carbon and water footprints.

Inphi Samples Industry’s First Coherent DSP Enabling 400G Pluggables Setting an Industry Benchmark in Power and Performance

Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, today announced that the company is sampling its new Canopus™ coherent Digital Signal Processor (DSP), the industry’s first merchant 7nm coherent DSP.

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