SEMI announced today that Industry Strategy Symposium (ISS) 2020 will take place January 12-15 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Data Driven Innovation and Growth. ISS is the year’s first executive check-in, offering perspectives from leading analysts, researchers, economists, and technologists on forces impacting the semiconductor industry. The annual symposium provides insights into growth opportunities and industry intelligence to help inform company business plans and forecasts based on current market conditions. Registration is now open.
Packaging
SET, Smart Equipment Technology, Introduces New Automatic Flip-Chip Bonder Dedicated to Device Production
SET, Smart Equipment Technology, the leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonderdesigned for± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM).NEO HB is suitable for direct hybrid bonding processes.
Presto Adds New Executives to the Leadership Team
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announces the hire of two new executives: Sophie Vaucher, vice president Finance, and Alexandra Moulin, vice president Human Resources. Sophie Vaucher brings ten years of experience in corporate finance and strategy in international industrial companies. Most recently, she held a global finance business partner role at Sibelco where she served in various senior positions for eight years. She was positioned in Asia for four years, where she integrated a new acquisition in the group and set up local teams.
North American Semiconductor Equipment Industry Posts October 2019 Billings
“Monthly billings of North American equipment manufacturers registered their first year-over-year increase since October 2018 and are at their highest level since December of last year,” said Ajit Manocha, president and CEO of SEMI. “Equipment billings are accelerating on the strength of memory inventory drawdowns and foundry investments in leading-edge equipment.”
TSMC Recognizes ANSYS With Two Partner of the Year Awards
TSMC presented ANSYS (NASDAQ: ANSS) with two Partner of the Year awards at the TSMC 2019 Open Innovation Platform® (OIP) Ecosystem Forum. ANSYS’ multiphysics simulation solutions for TSMC’s industry-leading FinFET process and advanced three-dimensional integrated circuit (3D-IC) packaging technologies enable customers to accelerate the development of artificial intelligence (AI), 5G, mobile, high-performance computing (HPC) and automotive applications.
Synopsys Completes Acquisition of DINI Group
Synopsys, Inc. today announced it has completed its acquisition of DINI Group, an established leader in FPGA-based boards and solutions, headquartered in La Jolla, California. The rapid growth of software used in automotive, artificial intelligence (AI), 5G, and high-performance computing (HPC) applications creates an enormous hardware/software validation challenge for system-on-chip (SoC) designers. To address this challenge, SoC designers are deploying FPGA-based prototyping solutions to enable software development to start earlier and accelerate hardware verification and system validation.
IBM Elects Thomas Buberl to Its Board of Directors
The IBM (NYSE:IBM) board of directors has elected Thomas Buberl to the board, effective April 28, 2020.Mr. Buberl, 46, is the chief executive officer of AXA S.A. Headquartered in Paris, France, AXA is one of the world’s largest global insurance firms. Since becoming CEO in September 2016, Mr. Buberl has been leading AXA through a digital transformation, accelerating business innovation and leveraging data to meet customers’ rapidly evolving needs in the digital world.
Presto Engineering Achieves EAL6 Certification for Secure Product Provisioning
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, has achieved EAL6 (Evaluation Assurance Level 6) — an assurance and independent verification of very high levels of security to protect valuable data. Secured applications initiated with the smart card industry and now permeate most industrial applications, as well as automotive and IoT. EAL, which ranges from 1-7 (a higher level means that the evaluation completed a more stringent set of quality assurance requirements), is a critical aspect to consider when selecting an outsourced manufacturing partner for secure applications.
Heilind Electronics Adds American Sensor Technologies (AST) to TE Connectivity Portfolio
Heilind Electronics, a premier distributor of electronic components worldwide, has partnered with TE Connectivity (TE) to bring its customers an extensive range of harsh environment pressure and liquid level sensors. The new products are part of TE’s American Sensor Technologies (AST) brand, which complements the distributor’s existing TE Measurement Specialties solutions. A key part of Heilind’s new AST offering is hazardous location pressure transducers. These items are certified to CSA, UL, ATEX and other standards that qualify them as explosion proof, intrinsically safe or non-incendive. In addition, customers can request customized designs and configure options like process connections, materials, pressure ranges and output.
Renesas Electronics Expands RA Microcontroller Ecosystem with Ready to Use Partner Solutions
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications.
