Packaging

Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s StepFAST Solution is a feed-forward adaptive shot technology that addresses process variations, die placement errors and dimensionally unstable materials that are common in existing and next-generation advanced packaging technologies. The elements included in the StepFAST Solution are Rudolph’s Firefly™ system…

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