Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Absolics, an affiliate of the Korea-based SKC, have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $75 million in direct funding under the CHIPS and Science Act to help advance U.S. technology leadership.
Packaging
SEALSQ RISC-V Chips Adoption is Predicted to Get AI Boost Making it a Viable Competitor to Traditional GPUs
RISC-V technology is revolutionizing the microchip industry, challenging established giants and paving the way for transformative changes. By the end of 2022, the industry had already embraced over 10 billion RISC-V cores, with thousands of engineers globally contributing to RISC-V projects.
The Dominican Republic and Purdue University Sign MOU to Drive Semiconductor Growth
The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country’s semiconductor industry and national development.
NHanced Semiconductors Launches New Website
Redesigned website showcases the company’s innovative Foundry 2.0 manufacturing model, with intuitive navigation and more news and blog options.
Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for DC-DC Applications
By reducing the footprint size to enable a more efficient high-power design, the AONG36322 XSPairFET provides a leading solution for space-constrained DC-DC Buck applications.
Lattice Introduces Advanced 3D Sensor Fusion Reference Design for Autonomous Applications
Lattice Semiconductor, the low power programmable leader, today announced a new 3D sensor fusion reference design to accelerate advanced autonomous application development.
Andes Technology and Arteris Partner To Accelerate RISC-V SoC Adoption
Andes Technology and Arteris partnership aims to support the growing adoption of RISC-V SoCs by mutual customers.
Wise-integration & Leadtrend Technology Introduce GaN System-in-Package
Wise-integration and Leadtrend Technology Corporation, a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.
SEMICON Europa 2024 Call for Abstracts Opens
Presentation abstracts now accepted for Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit.
Micron Expands Workforce Development Collaborations to Meet Future Semiconductor Job Demand
Partnership with GlobalFoundries and the U.S. National Science Foundation, along with MSI Semiconductor Network and new commitments to aid groups, critical to building semiconductor talent pipeline.
