Dynamic data routing could make for faster photonic chips that use their entire footprint.
Packaging
Fabs Valued at Nearly $50 Billion to Start Construction in 2020
Investments in new fab projects starting construction in 2020 is expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to the latest update of the World Fab Forecast from SEMI.
Spirit Electronics to Offer Susumu Thin Film Resistors
Value-added distributor Spirit Electronics today announced a distribution agreement with Susumu International Inc., a specialist in thin film technologies and thin film resistors. Susumu develops and manufactures metal thin film chip resistors with high precision, high reliability and high power characteristics.
Kingston Technology Takes Top Spot as DRAM Module Supplier
Kingston Technology Company, Inc. today announced it has been ranked the top DRAM module supplier in the world, according to the latest rankings by DRAMeXchange, a division of TrendForce. Kingston retains its number 1 position with an estimated 72.17 percent market share, according to TrendForce.
SEMICON Europa: SMART MedTech Forum Focuses on Innovation, Future of Medical Technology
Cutting-edge medical technology will highlight SEMICON Europa, 12-15 November, 2019 at Messe München, in Munich, Germany, as the SMART MedTech Forum gathers industry experts for insights into the latest developments and trends in medtech innovations driven by semiconductors. The SMART MedTech Forum is Europe’s first event to foster collaboration across the semiconductor and medtech value chains. SEMICON Europa registration is open for visitors and exhibitors.
Narrow Plasmonic Surface Lattice Resonances Prefer Asymmetric Dielectric Environment
A research group led by Dr. LI Guangyuan and Dr. LU Yuanfu from the Shenzhen Institutes of Advanced Technology (SIAT) of the Chinese Academy of Sciences reported a novel type of SLR based on metal-insulator-metal (MIM) arrays. The paper, entitled “Narrow plasmonic surface lattice resonances with preference to asymmetric dielectric environment,” was published on Sep. 2 in Optics Express and was highlighted as an Editor’s Pick.
Delphi Technologies to Partner with Cree for Automotive Silicon Carbide Devices
Delphi Technologies PLC (NYSE: DLPH), a global provider of automotive propulsion technologies, and Cree, Inc. (Nasdaq: CREE), a leader in silicon carbide semiconductors, announce a partnership to utilize silicon carbide semiconductor device technology to enable faster, smaller, lighter and more powerful electronic systems for future electric vehicles (EV).
Nexperia Secures $1,500m Financing to Fund Future Growth Plans
Nexperia, an expert in discrete and MOSFET components and analog & logic ICs, today announced the successful raise of USD 1,500 million equivalent of senior credit facilities. The proceeds will be used to refinance the existing outstanding debt and to partly finance the acquisition by Wingtech Technologies Co., Ltd., a listed Chinese computer and telecom equipment manufacturer.
Samsung Successfully Develops Industry’s First “Key Value” SSD Prototype that Meets New Open Standard
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced development of the first standards-based prototype of a new type of SSD that features extensive scalability, unmatched durability and CPU-relieving functionality.
New Insulation Technique Paves The Way For More Powerful and Smaller Chips
Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips.
