USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a collaboration to design, fabricate and package integrated circuits (ICs) through USC ISI’s MOSIS unit. The collaboration combines MOSIS’s industry-leading integrated circuit manufacturing expertise with Intel’s high-performance complementary metal-oxide semiconductor (CMOS) fabrication and packaging technology. It positions ISI and Intel Custom Foundry (ICF) to lead a new era of high-performance microelectronic manufacturing for the U.S. and global IC…
Packaging
Sensors/Actuators Reach Record Sales on Slower Growth
After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.
SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time
Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key concessions in a proposed Trump administration deal.
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI…
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
IC Insights will release its May Update to the 2019 McClean Report later this month. This Update includes a discussion of…
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has…
