TopLine Corporation announced today that Martin Hart, CEO of TopLine and inventor, has been awarded US Patent D874,413 S for a fixture designed to deliver 1752 solder columns onto a substrate as part of the Ceramic Column Grid Array (CCGA) assembly process. The patent was awarded on February 4, 2020.
Packaging
EV Group Establishes Heterogenous Integration Competence Center
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
GLOBALFOUNDRIES Delivers Industry’s First Production-ready eMRAM on 22FDX Platform for IoT and Automotive Applications
GLOBALFOUNDRIES® (GF®) today announced its embedded magnetoresistive non-volatile memory (eMRAM) on the company’s 22nm FD-SOI (22FDX®) platform has entered production, and GF is working with several clients with multiple production tape-outs scheduled in 2020. Today’s announcement represents a significant industry milestone, demonstrating the scalability of eMRAM as a cost-effective option at advanced process nodes for Internet of Things (IoT), general-purpose microcontrollers, automotive, edge-AI (Artificial Intelligence), and other low-power applications.
Micron Partners With Seven Industrial Companies to Deliver Robust and Innovative Solutions
Backed by Micron and other founding members such as Advantech, ATP Electronics, Greenliant, Innodisk, Kontron, Mercury Systems and Viking Technology, Micron’s IQ Partner Program promotes design solutions that deliver high-quality, robust and long-lasting products across a breadth of industrial applications such as factory automation, transportation and defense systems.
IAR Systems Extends Arm Tools Offering With Support for Renesas Electronics’ RA Family
Today, IAR Systems® announces full coverage for the RA Arm® Cortex® microcontrollers (MCUs) from Renesas Electronics Corporation. The complete development toolchain IAR Embedded Workbench® provides powerful code optimizations and comprehensive debugging features in an easy-to-use integrated development environment with excellent worldwide technical support and training.
MagnaChip Launches New MOSFET to Enhance Protection for Wireless Earphones While Recharging
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today the company is entering the wireless earphone market with the introduction of a new MOSFET for wireless earphones for preventing the battery from overcharging. This MOSFET is designed to control excessive current flowing into wireless earphones while recharging the battery in order to protect wireless earphones from being damaged.
Black Phosphorous Tunnel Field-Effect Transistor as an Alternative Ultra-Low Power Switch?
Researchers have reported a black phosphorus transistor that can be used as an alternative ultra-low power switch. A research team led by Professor Sungjae Cho in the KAIST Department of Physics developed a thickness-controlled black phosphorous tunnel field-effect transistor (TFET) that shows 10-times lower switching power consumption as well as 10,000-times lower standby power consumption than conventional complementary metal-oxide-semiconductor (CMOS) transistors.
CEA-Leti and CEA-IRIG Demonstrate Quantum Integrated Circuit Combining Quantum Dot with Digital-Analog Circuits on CMOS Chip
Leti, an institute of CEA, and CEA-IRIG, a fundamental research institute, have created the world’s first quantum integrated circuit that demonstrates the possibility of integrating conventional electronic devices and elements with quantum dots on a CMOS chip.
Qualcomm Executive Joins Si2 Board of Directors
Pankaj Kukkal, vice president of Engineering at Qualcomm Inc., has been elected to the Silicon Integration Initiative board of directors. Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
Renesas Electronics and 3db Access to Collaborate and Bring Secure Ultra-Wideband Solutions to Market
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, and 3db Access AG, a fabless semiconductor company specializing in secure ultra-wideband (UWB) low power chips, jointly announced that Renesas will license 3db UWB technology and will collaborate to bring best-in-class secure access solutions to the connected smart home, Internet of Things (IoT), Industry 4.0, mobile computing, and connected vehicle applications. The collaboration combines each company’s technical leadership in performance, size reduction, ultra-low power consumption, and security to deliver breakthrough multi-receiver UWB solutions to the global market.
