The Semiconductor Industry Association (SIA) Board of Directors today elected Keith Jackson, President, CEO, and Director of ON Semiconductor, as its 2020 Chair and Robert Bruggeworth, President, CEO, and Director of Qorvo, as its 2020 Vice Chair. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor sales.
Packaging
Transphorm Ships Over Half a Million GaN Power Devices for Multi-kilowatt Class Applications
Transphorm Inc. — a leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified 650 V gallium nitride (GaN) semiconductors — disclosed that it has shipped more than 500 thousand high voltage GaN FETs. The company hit this milestone as customers continue to adopt its high quality-high reliability GaN platform. Industry analyst firm IHS Markit Technology, now a part of Informa Tech, forecasts the total GaN power discrete, module, and system IC revenues to reach $1.2 billion by 2028. Approximately $750 million of those revenues (almost two-thirds of the total market) will be driven by high voltage GaN solutions.
Tech to Change the World: Lux Research Releases Annual List of Transformational Technologies
A combination of megatrends, market demand, and new innovations has thrust many technologies into the spotlight. Lux Research – a leading provider of tech-enabled research and advisory services – released its annual report on the tech innovations that are likely to have the greatest impact during the next 10 years. The new report combines the power of insights from technology experts with proprietary data science tools to better guide innovation decision making. Lux’s “20 for 2020” identifies and ranks 20 technologies that will reshape the world, based on innovation interest scores from the Lux Intelligence Engine, along with input from Lux’s leading analysts. It provides data-backed context for the ever-shifting technology landscape and insights into how companies can maximize the investment opportunities these data trends reveal.
Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
IC Insights’ November Update to The McClean Report 2019 will include a capital spending forecast for the major semiconductor companies for 2019 and 2020.
SEMI 3D & Systems Summit to Spotlight Latest in 3D Roadmap, Heterogeneous Integration and System-in-Package Technologies
Top experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies. 3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications. Registration is now open with early-bird pricing until 30 November, 2019.
Broadcom Completes Acquisition of Symantec Enterprise Security Business
Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, today announced that it has completed its acquisition of the Enterprise Security business of Symantec Corporation (NASDAQ: SYMC). Symantec’s Enterprise Security business will now operate as the Symantec Enterprise division of Broadcom and will be led by Art Gilliland as SVP and General Manager.
Renesas Builds New RE Family for Energy Harvesting
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced its RE Family, which encompasses the company’s current and future lineup of energy harvesting embedded controllers. The RE Family is based on Renesas’ proprietary SOTB™ (Silicon on Thin Buried Oxide) process technology, which dramatically reduces power consumption in both the active and standby states, eliminating the need for battery replacement or recharging.
China GDP and PMI Contraction A Risk Factor For Global Economy
IC Insights recently released its October Update to The McClean Report 2019. Part of the update reviewed U.S. and China GDP and PMI trends in light of the current trade friction between the two nations.
James C. Morgan, Chairman Emeritus of Applied Materials, Inc., Awarded the Global Semiconductor Alliance’s Premier Accolade
The Global Semiconductor Alliance (GSA) will honor James (“Jim”) C. Morgan, Chairman Emeritus of Applied Materials, Inc., with the esteemed Dr. Morris Chang Exemplary Leadership Award at its highly-anticipated Annual Awards Dinner to be held in Santa Clara, Calif., on Dec. 5, 2019. Morgan is an industry leader and visionary who led Applied Materials for nearly three decades — one of the longest tenures of a Fortune 500 CEO. He served as CEO from 1977 to 2003 and chairman of the board from 1987 to 2009, growing Applied from less than $20 million to more than $9 billion in revenue during that time.
Synopsys Accelerates Cloud Computing SoC Designs with New Die-to-Die PHY IP in Advanced 7nm FinFET Process
Synopsys, Inc. (Nasdaq: SNPS) today announced its DesignWare® Die-to-Die PHY IP for ultra- and extra-short reach connectivity in multi-chip modules (MCM) for hyperscale data center, AI, and networking designs. The DesignWare Die-to-Die PHY IP supports NRZ and PAM-4 signaling from 2.5G to 112G data rates, delivering maximum throughput per die edge for large MCM designs. To improve SoC yield, the Die-to-Die PHY allows for partitioning of large dies into smaller dies while offering trade-offs for power, bandwidth per beachfront, latency, and reach.
