Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services. With this acquisition, Presto adds ASIC design to its suite of services for the Industry 4.0, IoT, and autonomous driving market.
Packaging
Onto Innovation Announces Multiple Orders to Support 5G Ramp
Onto Innovation Inc. (NYSE: ONTO) announced that it has received orders totaling 15 systems from two leaders in advanced packaging. Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions.
Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure
Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.
A New Wave of Fan-Out Packaging Growth
Key players from different business models are fueling new growth.
2019 Global Silicon Shipments Dip From 2018 Record High But Revenue Remained Stable Above $11 Billion
Worldwide silicon wafer area shipments in 2019 declined 7 percent from the 2018 record high while revenue remained above the $11 billion mark despite a global silicon revenue slip of 2 percent over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry. Silicon wafer area shipments in 2019 totaled 11,810 million square inches (MSI), while the industry logged shipments of 12,732 million square inches in 2018. Revenues in 2019 totaled $11.15 billion, edging down from the $11.38 billion posted in 2018.
ZEISS Accelerates Semiconductor Package Failure Analysis by Orders of Magnitude with Crossbeam Laser FIB-SEM
ZEISS today introduced the ZEISS Crossbeam Laser — a new family of site-specific focused ion beam scanning electron microscope (FIB-SEM) solutions that accelerate package failure analysis and process optimization for advanced semiconductor packages. Integrating a femtosecond laser for speed, a gallium ion (Ga+) beam for accuracy, and SEM for nanoscale-resolution imaging, the ZEISS Crossbeam Laser family provides package engineers and failure analysts with the fastest cross-section solution at the highest imaging performance, while providing minimal sample damage.
SEMI Postpones SEMICON China, Suspends SEMICON Korea in Response to Coronavirus Outbreak
In accordance with government guidelines and to protect the health and safety of exhibitors and guests, SEMI announced Tuesday the postponement of SEMICON/FPD China 2020 and related events originally scheduled for March 18-20, 2020. SEMI China is actively working on a contingency plan for rescheduling of the event and will keep you informed as soon as a confirmed plan is in place.
Abating Potentially Dangerous Particles 2.5 µm and Smaller
Particles, especially fine particles, are very important because of their impact on human health.
NeoPhotonics Samples High Power Semiconductor Optical Amplifiers and Narrow Linewidth Lasers for Coherent Lidar Transceivers
NeoPhotonics Corporation (NYSE: NPTN), a leading designer and manufacturer of advanced hybrid photonic integrated circuit based modules and subsystems for bandwidth-intensive, high speed communications networks, today announced that it is sampling high power Semiconductor Optical Amplifiers (SOAs) and Narrow Linewidth (NLW) Distributed Feedback Lasers (DFB) lasers for long range automotive Lidar (“light detection and ranging”) applications.
Picosun’s ALD Technology Helps to Fight Climate Change
Picosun’s Atomic Layer Deposition (ALD) thin film barrier coating technology offers a solution for eliminating the use of hazardous process gases, sulphur hexafluoride (SF6) and nitrogen trifluoride (NF3). By switching to Picosun’s ALD nanolaminate barrier technology it is possible to obtain unmatched barrier performance with extremely thin, pinhole-free films. This also eliminates the need to clean the deposition equipment after every few process runs.
