Packaging

MagnaChip Offers 0.35 micron 700V Ultra-High Voltage Process Technologies for Various System Requirements

MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers 0.35 micron 700V Ultra-High Voltage process technologies (UHV) suitable for different system requirements for AC-DC converter ICs and LED driver ICs.

Hprobe to Present Breakthrough Technology for Ultra-Fast Magnetic Testing of MRAM Devices above 2 Tesla

Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, will present at the MRAM Developer Day 2019*, a new technology of magnetic generator for ultra-fast testing time (less than one second) of Magnetic Tunnel Junction (MTJ) for Spin Transfer Torque (STT) MRAM devices under perpendicular magnetic field at above 2 Tesla.

Sage Microelectronics and Everspin Partner to Bring Spin-transfer Torque MRAM to Next Generation Enterprise SSD Devices

Everspin Technologies, Inc., a developer and manufacturer of Magnetoresistive RAM (MRAM) persistent memory solutions, announced its partnership with Sage Microelectronics Corporation.

Silvaco Appoints Babak Taheri as New Chief Executive Officer

Silvaco, Inc. today announced that its Board of Directors has appointed Babak Taheri to the position of Chief Executive Officer. He will also join Silvaco’s Board of Directors. Taheri has served as Silvaco’s Chief Technical Officer and Executive Vice-President of Products since October 2018. He succeeds David Dutton who has been CEO since 2015. Dutton remains on the Silvaco Board in the position of Vice-Chairman. “The Board of Directors determined…

Silicon Technologies Awarded Contract with US Government for Next Generation Radiation Hardened Electronics IP

Silicon Technologies Inc (STI) today announced winning a two-year contract with the Government to develop Radiation Hardened by Design (RHBD), Process Portable, Mixed Signal Design IP.

Microsoft, GLOBALFOUNDRIES Join Si2 OpenAccess Coalition

Microsoft Corporation and GLOBALFOUNDRIES have joined Silicon Integration Initiative’s OpenAccess Coalition, a diverse group of international semiconductor companies that support the OpenAccess design database application programming interface.

DARPA 3DSoC Initiative Completes First Year, Update Provided at ERI Summit on Key Steps Achieved to Transfer Technology into SkyWater’s 200mm U.S. Foundry

Progress moves technology closer to availability of a standard foundry process designed to greatly increase compute performance and energy efficiency.

Flash Memory Summit Announces Lifetime Achievement Award Winner for 2019

Flash Memory Summit (FMS), to be held August 6-8 at the Santa Clara Convention Center, is pleased to announce Sanjay Mehrotra as the recipient of its 2019 Lifetime Achievement Award, “for co-founding SanDisk, advancing the architecture that enabled the industry and marketplace for flash memory, and leadership of Micron Technology, Inc. and the Semiconductor Industry Association.”

North American Semiconductor Equipment Industry Posts June 2019 Billings

June billings of North American equipment manufacturers fell nearly three percent when compared to the prior month.

TriLumina Announces World’s First Automotive-Qualified AEC-Q102 Grade 1 Semiconductor Laser

This marks the first time any semiconductor laser product has qualified for AEC-Q102 Grade 1 Operation.

Featured Products