Packaging

ESD Alliance Takes SMART Design to SEMICON Europa

The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, today unveiled SMART Design, the first system-centric series showcasing advances in electronic system design to be held at SEMICON Europa. SEMICON Europa will begin Tuesday, November 12, through Friday, November 15, at Messe München in Munich, Germany. SMART Design is scheduled for Wednesday, November 13, from 2:30 p.m. until 5 p.m. in TechARENA 1, Hall B1.

Samsung Expands its Commitment to Foundry Customers with the First ‘SAFE Forum 2019’

Samsung Electronics Co., Ltd. today held the first Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2019 in the United States. By sharing the latest technology trends and strengthening cooperation within the foundry ecosystem, Samsung showcased its strong dedication to customers. SAFE Forum is designed to provide an opportunity for SAFE partner companies to directly meet with customers to discuss comprehensive design technology infrastructure, including electronic design automation (EDA), intellectual property (IP), cloud, design service, and packaging, which is critical to efficiently developing and manufacturing semiconductor products.

New Transient-Voltage-Suppression Diodes from STMicroelectronics Deliver Higher Protection in Smaller Packages

In addition to the lower profile, ST’s new 1500W SMB Flat package has transient-power capability equivalent to that of conventional devices in SMC packages, in a footprint more than 50% smaller. The 400W and 600W SMA Flat and SMB Flat devices are fully footprint-compatible with alternatives in conventional SMA and SMB packages. Leakage current is five times lower compared with other TVS diodes on the market, minimizing impact on system operation and power consumption.

Paving a Way to Achieve Unexplored Semiconductor Nanostructures

Nanowire is a rod-structure with a diameter typically narrower than several hundred nanometers. Due to its size and structure, it exhibits characteristic properties which are not found in larger bulk materials. The study of III-V semiconductor nanowires has attracted much interest in recent decades due to their potential application in nanoscale quantum, photonic, electronic, and energy conversion, and in biological devices, based on their one-dimensional nature and large surface to volume ratio.

Synopsys Design Platforms Enabled for Samsung Foundry 2.5D-IC Multi-Die Integration

Synopsys, Inc. today announced availability of design solutions to support Samsung Foundry’s 2.5D-IC Multi-Die Integration (MDI™) on its 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology, known as 7LPP. The Synopsys Fusion Design Platform™ and Custom Design Platform enable quicker design prototyping and analysis to help designers address the time-to-market pressures associated with delivery to accelerating markets, such as 5G, artificial intelligence (AI), and high-performance computing (HPC).

Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology

The use of multiple stacked chips in a single package is becoming a key trend for mobile, IoT and data center designs, which is also extending into the AI and 5G market segments due to the rapid and efficient integration of complete functions that can be implemented via the optimal process node into a system in package (SiP). The Cadence technology provides customers with analysis, implementation and physical verification capabilities within a single canvas and offers unique, early-stage system-level pathfinding and highly-complex design capabilities for 3D signoff. The Cadence flow has been optimized to enable customers to achieve all the benefits the Samsung Foundry MDI packaging technology has to offer in order to deliver new products to market with greater speed and agility.

GLOBALFOUNDRIES Acquires Smartcom’s PDK Engineering Team to Expand Worldwide Design Enablement Capacity

GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it has acquired the PDK (Process Design Kit) engineering team from Smartcom Bulgaria AD in Sofia, Bulgaria. The newly acquired team will enhance GF’s scale and capabilities, while strengthening competitiveness of its specialized application solutions to further position the company for growth and value creation.

Panasonic to Team up with IBM Japan in Improving Semiconductor Manufacturing Processes

On October 15, 2019, IBM Japan, Ltd. and Panasonic Corporation’s subsidiary, Panasonic Smart Factory Solutions Co., Ltd, announced that the companies have agreed to collaborate to develop and market a new high-value-added system to optimize the overall equipment effectiveness (OEE) of customers’ semiconductor manufacturing processes and to realize high-quality manufacturing. As part of its circuit formation process business, Panasonic currently develops and markets edge devices and manufacturing methods that contribute to improving semiconductor manufacturing of advanced packaging.

Energy Taiwan Opens Tomorrow to Opportunities in Renewable Energy as Experts from Industry, Government and Academia Gather

Opening tomorrow, Energy Taiwan today hosts a pre-show press conference with photovoltaic (PV) and offshore wind power experts exploring the future of smart energy, industry trends, and strategies for seizing renewable energy business opportunities. The largest renewable energy event in Taiwan, Energy Taiwan connects the global green energy supply chain for three days of expert insights into the latest technologies and business opportunities in solar PV, offshore wind power, hydrogen energy, smart energy storage, and green finance and insurance.

Chinese and Korean Materials Suppliers Profiting from Japanese Politics

Chinese materials suppliers are moving to take market- share at South Korean chip fabrication (fab) lines. Due to residual animosity from 20th century wars, Japanese politicians decided to use the semiconductor materials supplier-chain as a pawn in a political chess game and un-white-listed South Korea from exports. Any good-will between the two nations was immediately erased, and South Korea announced a US$6B government investment to as a huge driving force to help develop local supplies. Now Chinese chemical suppliers have unprecedented openings to qualifications at Korean-owned fabs, including commercial memory fabs in China.

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