Mentor, a Siemens business, announced that several tools in its Calibre™ nmPlatform and Analog FastSPICE (AFS™) Platform have been certified on TSMC’s 5nm FinFET process technology. Mentor also announced it has successfully completed reference flow materials in support of TSMC’s innovative System-on-Integrated-Chips (TSMC-SoIC™) multi-chip 3D stacking technology. “Mentor has yet again increased its value to TSMC’s ecosystem by offering more features and solutions in support of our most advanced process,” said Suk…
Packaging
Semiconductor Leaders Strike Agreement on Global Policy Agenda
The Semiconductor Industry Association welcomed a policy agreement reached by global semiconductor industry leaders at the 23rd annual meeting of the World Semiconductor Council this week in Xiamen, China.
IEEE International Electron Devices Meeting Announces 2019 Call for Papers
The 65th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union…
Edwards Responds to United Nations’ New Greenhouse Gas Guidelines
The Intergovernmental Panel on Climate Change (IPCC), the United Nations’ body for assessing the science…
USC ISI and Intel Custom Foundry Collaborate to Spur Microelectronics Innovation
USC Viterbi’s Information Sciences Institute (ISI) and the Intel Corporation’s custom foundry organization today announced a…
Sensors/Actuators Reach Record Sales on Slower Growth
After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.
SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time
Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key concessions in a proposed Trump administration deal.
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI…
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
IC Insights will release its May Update to the 2019 McClean Report later this month. This Update includes a discussion of…
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has…
