After two strong years, the sensor and actuator market has cooled off as a result of inventory drawdowns, slowing unit shipments, and economic uncertainty, says report.
Packaging
SEMI Spring Washington Forum – Connecting Members with Policymakers at a Critical Time
Tensions between the United States and China have reached fever pitch. Ongoing trade negotiations between the U.S. and China broke down earlier this month over reported backpedaling by China on key concessions in a proposed Trump administration deal.
Audi First Carmaker To Join SEMI
SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced that AUDI AG, a leading German manufacturer of luxury vehicles, has become the first automotive OEM to join SEMI. SEMI membership will give Audi access to SEMI core competencies in developing international standards and harmonizing technology roadmaps and enable the automaker to leverage the global SEMI platform to promote industry alignment across supply-chain segments. Audi is a…
Intel Recaptures Number One Quarterly Semi Supplier Ranking from Samsung
IC Insights will release its May Update to the 2019 McClean Report later this month. This Update includes a discussion of the 1Q19 IC industry market results, an updated quarterly forecast for the remainder of this year, and a look at the top-25 1Q19 semiconductor suppliers. The top-15 1Q19 semiconductor suppliers are covered in this research bulletin. The top-15 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 1Q19 is shown in…
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s StepFAST Solution is a feed-forward adaptive shot technology that addresses process variations, die placement errors and dimensionally unstable materials that are common in existing and next-generation advanced packaging technologies. The elements included in the StepFAST Solution are Rudolph’s Firefly™ system…
