Scientists at Tokyo Institute of Technology(Tokyo Tech) explore a new material combination that sets the stage for magnetic random access memories, which rely on spin–an intrinsic property of electrons– and could outperform current storage devices. Their breakthrough published in a new study describes a novel strategy to exploit spin-related phenomena in topological materials, which could spur several advances in the field of spin electronics. Moreover, this study provides additional insight into the underlying mechanism of spin-related phenomena.
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Founder of Tera-Barrier Films named Innovator of the Year for Technology
Tera-Barrier Films Pte Ltd (TBF) Founder and Chief Technology Officer Senthil Ramadas clinched the Innovator of the Year Award for Technology at the Singapore Business Review Management Excellence Awards 2019. When Senthil was still with the Institute of Materials Research and Engineering of the Agency for Science, Technology & Research (A*STAR), he developed a platform barrier technology for flexible electronics, organic solar and displays. Subsequently, he spun-off the technology from A*STAR to start Tera-Barrier Films.
MIPT Physicists Find Ways to Overcome Signal Loss in Magnonic Circuits
Researchers from the Moscow Institute of Physics and Technology, Kotelnikov Institute of Radio Engineering and Electronics, and N.G. Chernyshevsky Saratov State University have demonstrated that the coupling elements in magnonic logic circuits are so crucial that a poorly selected waveguide can lead to signal loss. The physicists developed a parametric model for predicting the waveguide configuration that avoids signal loss, built a prototype waveguide, and tested the model in an experiment. Their paper was published in the Journal of Applied Physics.
XMC Introduces 50nm High-Performance Serial NOR Flash Memory
As a world leading provider of non-volatile memory, XMC, a core subsidiary of Unigroup, today announced the mass production status of new SPI NOR Flash series – XM25QWxxC, with the industry’s advanced 50nm Floating Gate NOR Flash manufacturing process, which features wide voltage range and low power consumption, offering excellent design flexibility for IoT, wearable and other power consumption sensitive applications.
Boston Semi Equipment Extends Peak Voltage for Handling MOSFET, IGBT, Gate Arrays and SiC Power ICs
Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and an innovative provider of test automation technical services, announced today that it has enhanced its Zeus gravity feed handlers for MOSFET, IGBT, gate drivers, and SiC power ICs. A new test site design provides increased voltage isolation during testing, raising the peak voltage handled by the Zeus high voltage handler to 8.4kV RMS (11.8kV peak). The growing market for power ICs is driven by increasing demand for energy efficient products, such as electric vehicles. Automotive, medical, industrial and consumer markets will benefit from the efficiencies and lower cost of test by handling high voltage MOSFET, IGBT, gate drivers, and SiC devices in BSE’s Zeus handler.
Baidu and Samsung Electronics Ready for Production of Leading-Edge AI Chip for Early Next Year
Baidu, Inc. (NASDAQ: BIDU), a leading Chinese-language internet search provider, and Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year. Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution.
QuickLogic Names New Chairman of the Board
QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP, and Endpoint AI solutions, today announced the appointment of Michael R. Farese as the Chairman of the Board of Directors, effective December 6, 2019 to replace E. Thomas Hart, who passed away on December 3, 2019. Michael R. Farese (Ph.D.) has been serving as a member of QuickLogic’s Board of Directors since April 2008, most recently as the lead independent director, and brings to the position a deep understanding of consumer products, converged devices and wireless markets.
Aldec’s New FPGA-based NVMe Data Storage Solution Targets High Performance Computing Applications
Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA and ASIC designs, has launched a powerful, versatile and time- saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning. The solution includes an Aldec TySOM embedded prototyping board, up to eight high-bandwidth, low- latency FMC-NVMe daughter cards, and a reference design (including source files and binaries) allowing engineers to fast-track their projects.
Nordson Corporation Announces Planned Retirement of Chief Financial Officer
Nordson Corporation (NASDAQ-NDSN) today announced that Gregory A. Thaxton, Executive Vice President and Chief Financial Officer, plans to retire in 2020 after thirty successful years with the company, with the last 12 years as CFO. The company has initiated a search of internal and external candidates for his successor. Mr. Thaxton will remain in his current role throughout this transition period. Mr. Thaxton started his career with Nordson in 1989. He became part of the executive leadership team in February 2007 when he was named Corporate Controller and Chief Accounting Officer. He was appointed CFO in January 2008.
Enflame Technology Announces CloudBlazer with DTU Chip on GLOBALFOUNDRIES 12LP FinFET Platform for Data Center Training
In conjunction with the launch of Enflame’s CloudBlazer T10, Enflame Technology and GLOBALFOUNDRIES® (GF®) today announced a new high-performing deep learning accelerator solution for data center training. Designed to accelerate deep learning deployment, the accelerator’s core Deep Thinking Unit (DTU) is based on GF’s 12LP™ FinFET platform with 2.5D packaging to deliver fast, power-efficient data processing for cloud-based AI training platforms.
