Last week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology.
Packaging
Synopsys Awarded DARPA ERI Contract Extension
Synopsys, Inc. (Nasdaq: SNPS) today announced a contract extension from the Defense Advanced Research Projects Agency (DARPA) for the Posh Open Source Hardware (POSH) program to continue innovations in analog/mixed-signal (AMS) verification.
The MOSIS Service Selects Synopsys’ IC Validator for Large-scale FinFET SoCs
Synopsys, Inc. today announced that The MOSIS Service, a provider of Multi-Project Wafers, has selected Synopsys’ IC Validator tool for physical verification signoff.
Worldwide PC Shipments Grew 1.5 Percent in Second Quarter of 2019
After two quarters of decline, the worldwide PC market grew 1.5% in the second quarter of 2019, according to preliminary results by Gartner, Inc. Shipments totaled 63 million units in the second quarter of 2019, up from 62 million units in the second quarter of 2018.
Digi-Key Announces Exclusive Global Distribution Partnership with Helix Semiconductors
Digi-Key Electronics, a global electronic components distributor, announces that it has expanded its product portfolio by signing an exclusive global distribution partnership with Helix Semiconductors.
Standards Industry Leaders Honored at SEMICON West 2019
SEMI yesterday honored five industry leaders at SEMICON West 2019 for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards 1000th Standard Celebration.
CEA-Leti and UnitySC Announce Further Collaboration
Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools’ footprint and cost of ownership.
CMOS Image Sensors: Expect a 10.1% Year-on-Year Growth Rate for 2019
CIS has become a key market segment in the semiconductor industry, reaching US$15.5 billion in 2018.
2019 Rare Earths Rarely So Strategic
Global supply-chains are being disrupted by the U.S./China trade wars, driving increased awareness of the strategic importance of rare-earth elements (REE).
CEO Panel Tackles the Future of Moore’s Law Question
On Tuesday morning, Applied Materials hosted a CEO panel discussion with Aart de Geus, PhD, Chairman and co-Chief Executive Officer, Synopsys; Victor Peng, President and CEO, Xilinx; Lisa Su, PhD, President and CEO, AMD; Sanjay Mehrotra, President and CEO, Micron; and Gary Dickerson, President and CEO, Applied Materials. John Markoff, author and former technology writer with The New York Times acted as moderator.
