IC Insights will release its May Update to the 2019 McClean Report later this month. This Update includes a discussion of the 1Q19 IC industry market results, an updated quarterly forecast for the remainder of this year, and a look at the top-25 1Q19 semiconductor suppliers. The top-15 1Q19 semiconductor suppliers are covered in this research bulletin. The top-15 worldwide semiconductor (IC and O S D—optoelectronic, sensor, and discrete) sales ranking for 1Q19 is shown in…
Packaging
Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. (NYSE: RTEC) announced that an outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s StepFAST Solution is a feed-forward adaptive shot technology that addresses process variations, die placement errors and dimensionally unstable materials that are common in existing and next-generation advanced packaging technologies. The elements included in the StepFAST Solution are Rudolph’s Firefly™ system…
