Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
Packaging
The Honorable Kevin Rudd to Deliver Keynote Address at 2019 SIA Award Dinner
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced The Honorable Kevin Rudd, former prime minister of Australia and current president of the Asia Society Policy Institute, will deliver the keynote address at the 2019 SIA Award Dinner, which will take place on Thursday, Nov. 7 in San Jose, Calif. Rudd will offer insights on the future directions of the U.S.-China trade war, the risks of general economic decoupling, and implications for future collaboration in technology.
Synopsys Completes Acquisition of QTronic GmbH
Synopsys, Inc. (NASDAQ: SNPS) today announced it has completed its acquisition of QTronic GmbH, a leader in simulation, test tools, and services for automotive software and systems development headquartered in Germany. QTronic simulation and test tools will accelerate Synopsys delivery of a comprehensive automotive virtual prototyping solution for system and software development throughout the automotive electronic supply chain.
New Lattice CrossLinkPlus FPGAs Accelerate and Enhance Video Bridging for MIPI-based Embedded Vision Systems
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today introduced the CrossLinkPlus™ FPGA family for MIPI D-PHY based embedded vision systems. CrossLinkPlus devices are innovative, low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on panel display performance, and flexible on-device programming capabilities. Additionally, Lattice provides ready-to-use IPs and reference designs to accelerate implementation of enhanced sensor and display bridging, aggregation, and splitting functionality, a common requirement for industrial, automotive, computing, and consumer applications.
Global Market Remains Strong for ALD & CVD Precursors in IC Fabs
TECHCET—the advisory services firm providing electronic materials information— announced that the global market for atomic layer deposition (ALD) and chemical vapor deposition (CVD) precursors is showing strong growth despite semiconductor fabrication market challenges in 2019.
Toshiba Memory Today Rebrands As “Kioxia”
Kioxia Holdings Corporation, formerly Toshiba Memory Holdings Corporation, today announced that it is officially operating under its new corporate identity, effective immediately.
SEMI, Taiwan Government Team to Connect Global Green Energy Supply Chain at Energy Taiwan
Energy Taiwan, the largest renewable energy event in Taiwan connecting the global green energy supply chain, will gather more than 60 experts from industry, government and academia for insights on the latest technologies and business opportunities in solar photovoltaic, offshore wind power, hydrogen energy, smart energy storage, and green finance and insurance.
SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World
Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
Mitsubishi Electric Develops Trench-type SiC-MOSFET with Unique Electric-field-limiting Structure
Mitsubishi Electric Corporation announced today that it has developed a trench-type silicon-carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) with a unique electric-field-limiting structure for a power semiconductor device that achieves a world-leading specific on-resistance of 1.84 mΩ (milliohms) cm2 and a breakdown voltage of over 1,500 V.
Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022
Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in…
