Sivers Semiconductors AB today announced a strategic partnership with O-Net Technologies to produce high-performance external laser sources, a critical component enabling next-generation AI data center architectures.
Packaging
Altera Starts Production Shipments of Industry’s Highest Memory Bandwidth FPGA
Altera Corporation today announced production shipments of its Agilex 7 FPGA M-Series, the industry’s first high-end, high-density FPGA to feature integrated high bandwidth memory and support for DDR5 and LPDDR5 memory technologies
Completion of New Production Facility for Semiconductor Manufacturing Equipment in Kasado Area
Hitachi High-Tech Corporation announced that the new production facility for semiconductor manufacturing equipment was completed and started the operation on March 17, 2025.
NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
Rapidus Corporation today announced that its plans and budget for fiscal year 2025 have been approved by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
This system is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers
HieFo announced today the product launch of multiple new high-efficiency Continuous Wave DFB indium phosphide (InP) lasers, designed to address the ever-increasing demands of silicon photonics based optical transceivers.
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes.
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix Platform
Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
SEALSQ and IC’ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
Automotive Electrification Movement
Whether designing for passenger or commercial vehicles, engineers today must consider numerous complex, power-hungry systems and features that not only meet consumer and commercial demand but are also highly efficient, durable and safe.
