Micron Technology, Inc. today announced it has begun qualification of the 6550 ION NVMe SSD with customers.
Packaging
Physik Instrumente (PI) Expands Electronics Manufacturing in Rosenheim
Physik Instrumente (PI), the market and technology leader for high-precision positioning technology and piezo applications, has significantly expanded its electronics manufacturing site based in Rosenheim, Germany.
NY CREATES and Hprobe Announce Strategic Collaboration for Advanced Semiconductor Memory Testing
NY CREATES and Hprobe today announced a strategic collaboration aimed at advancing testing capabilities for next-generation semiconductor memory technologies.
Georgia Tech Joins Apple’s New Silicon Initiative
The Georgia Tech School of Electrical and Computer Engineering (ECE) is expanding its collaboration with Apple by joining the company’s New Silicon Initiative (NSI) – a program that aims to prepare students for careers in hardware technology, computer architecture, and silicon chip design.
SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth
SEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.
esmo group Launches Apollo Quad Handler to Revolutionize Semiconductor Testing
Designed to bridge the gap between the engineering and production phases, this advanced handler offers unprecedented flexibility, reliability, and energy efficiency for final test operations, setting a new standard for semiconductor testing.
Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding.
ROHM’s New 1200V IGBTs Achieve Industry-Leading Low Loss Characteristics with High Short-Circuit Tolerance
ROHM Semiconductor today announced new automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading low loss characteristics with high short-circuit resistance.
FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing
FormFactor, Inc. and Advantest Corporation announced today a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices.
ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool.
