Researchers propose a novel design for electromagnetic induction type vibration energy harvesters, boosting efficiency and power output.
Packaging
U.S. Department of Commerce Announces Preliminary Terms with MACOM
Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
The Semiconductor Industry Association (SIA) today released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
Aerotech Introduces New Mini Hexapod
Aerotech Inc. today introduced the HexGen HEX150-125HL Miniature Hexapod, a six degree-of-freedom (DOF) precision positioning system.
YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
Yield Engineering Systems (YES) is a manufacturer of process equipment for AI and HPC semiconductor solutions.
SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth
Industry Strategy Symposium (ISS) 2025 sessions open today gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.
Sivers Semiconductors Signs CHIPS Act Contracts with the Northeast Microelectronics Coalition Hub
The first half of $11.6M Microelectronics Commons funding for 5G/6G and Electronic Warfare chip technology to be received by January 2025.
CHIPS Incentives Award with HP to Support Domestic Manufacturing
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Cracking the Chip Code to Meet AI’s Growing Demands
For those wishing to push ahead, a heterogeneous system on chip (SoC) is stacked with possibilities.
2025: MEMS Leaps Forward
In 2025 and beyond, we can expect to see existing MEMS devices reimagined in new thin-film piezoelectric materials such as scandium aluminum nitride (ScAlN) and lead zirconate titanate (PZT), which will dramatically improve functionality, precision, and durability.
