Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
Packaging
POET Announces Design Win and Collaboration with Foxconn Interconnect Technology
POET and FIT have entered into a collaboration to develop 800G and 1.6T pluggable optical transceiver modules using POET optical engines with an aim to address the growth in demand from cutting-edge AI applications and high-speed data center networks.
Porotech Selects ClassOne Solstice Single-Wafer Platform
ClassOne Technology and Porotech today announced that Porotech has selected the ClassOne Solstice single-wafer platform for the development and manufacture of GaN products for applications requiring silicon wafer substrates.
NEO Semiconductor Reveals a Performance Boosting Floating Body Cell Mechanism for 3D X-DRAM
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced a performance boosting Floating Body Cell Mechanism for 3D X-DRAM.
Polar Semiconductor Announces Plans to Expand Semiconductor Manufacturing Facility in Minnesota
Polar Semiconductor, the only U.S.-based manufacturer specializing in sensor, power, and high-voltage semiconductors, today announced plans to expand its Bloomington, Minnesota manufacturing facility and branch into innovative technologies to serve new customers and markets.
Kevin O’Buckley to Lead Foundry Services at Intel
Intel Corporation today announced the appointment of Kevin O’Buckley as senior vice president and general manager of Foundry Services, the customer service and ecosystem operations division of Intel Foundry.
EFC Receives American Chemistry Council’s Sustainability Leadership Award
On May 9th, at its annual Responsible Care & Sustainability Conference, the American Chemistry Council (ACC) honored EFC Gases & Advanced Materials with a 2024 Sustainability Leadership Award, which recognizes exemplary products, technologies, and initiatives that advance sustainability.
SEMI Recognizes U.S. Senator Majority Leader Charles Schumer With Government Leadership Award
SEMI Americas President Joe Stockunas and TEL Vice President Ben Rathsack presented Senator Schumer with the award this week at the U.S. Capitol Building.
Department of Energy Announces $160 Million for Research to Form Microelectronics Science Research Centers
This funding will support the formation of Microelectronics Science Research Centers (MSRCs) focused on energy efficiency and extreme environments.
SK hynix Develops Next-Generation Mobile NAND Solution ZUFS 4.0
SK hynix Inc. announced today that it has developed the Zoned UFS, or ZUFS 4.0, a mobile NAND solution product for on-device AI applications. Zoned Universal Flash Storage(ZUFS) is a NAND Flash product that improves efficiency of data management.
