Packaging

Silicon Catalyst Ventures Launched to Support Early-stage Semiconductor Startups

Led by a team of seasoned investment and technology experts, in close collaboration with the Silicon Catalyst incubator.

Xpeedic Releases EDA 2024 Platforms

Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation.

Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry

Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.

USTC Integrates Wafer-Scale 2D Materials and Metal Electrodes with van der Waals Contacts

A research team led by Prof. ZENG Hualing, Prof. QIAO Zhenhua, and Prof. SHAO Xiang from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences (CAS) achieved progress in studying van der Waals (vdW) contacts for two-dimensional (2D) electrical devices.

CEA-Leti Scientists Detail Progress on 3D Integration Technologies and Promising Approaches for More Than Moore and RF Integrated Systems at VLSI

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute’s progress on 3D integration technologies, which are a promising approach for designing More than Moore systems, especially radio frequency (RF) integrated systems.

QP Technologies Expands Die Preparation Business

QP Technologies, a provider of innovative microelectronic packaging and assembly solutions, today announced it has added a dicing saw to its manufacturing line, expanding its die and wafer preparation business.

BAE Systems and GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs

Collaboration to focus on U.S. chip manufacturing and joint research and development for advanced chip technologies.

Silicon Wafers High Growth Now Uncertain

Excess inventory causing concerns and upturn in orders not yet realized.

Valin Corporation Now Offers Pneumatics Control Panels with UL 508 A Certification

Valin Corporation, a provider of technical solutions for the technology, energy, life sciences, natural resources, and transportation industries announces its latest addition to Valin Engineered Solutions – Pneumatics Control Panels. 

onsemi Selects the Czech Republic to Establish End-to-End Silicon Carbide Production for Advanced Power Semiconductors

Brownfield investment would bring critical manufacturing capabilities of energy efficient chips to Central Europe to power the future of electrification, renewables and AI.

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