Arm’s interconnect technology on GF’s 12LP process enables high performance and low latency, while increasing bandwidth for high core designs in AI, Cloud Computing and Mobile SoCs.
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Mid-Year Global Semiconductor Sales Down 14.5 Compared to 2018
Year-to-year sales down across all regions; 2019 Q2 sales up slightly compared to Q1.
Toshiba Memory Unveils New Technology for Removable NVMe Memory Devices with Groundbreaking Size to Performance Ratio
Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices.
Microchip Enters Memory Infrastructure Market with Serial Memory Controller for High-performance Data Center Computing
As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.
Toshiba Memory Introduces XL-FLASH Storage Class Memory Solution
Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH.
Lenovo and Intel Announce Multiyear Global Collaboration to Extend HPC and AI Leadership
Intel and Lenovo today announced a multiyear collaboration focused on the rapidly growing opportunity in the convergence of high-performance computing (HPC) and artificial intelligence (AI) to help accelerate solutions for the world’s most challenging problems.
MagnaChip Offers 0.35 micron 700V Ultra-High Voltage Process Technologies for Various System Requirements
MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor products, announced today it now offers 0.35 micron 700V Ultra-High Voltage process technologies (UHV) suitable for different system requirements for AC-DC converter ICs and LED driver ICs.
Hprobe to Present Breakthrough Technology for Ultra-Fast Magnetic Testing of MRAM Devices above 2 Tesla
Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, will present at the MRAM Developer Day 2019*, a new technology of magnetic generator for ultra-fast testing time (less than one second) of Magnetic Tunnel Junction (MTJ) for Spin Transfer Torque (STT) MRAM devices under perpendicular magnetic field at above 2 Tesla.
Sage Microelectronics and Everspin Partner to Bring Spin-transfer Torque MRAM to Next Generation Enterprise SSD Devices
Everspin Technologies, Inc., a developer and manufacturer of Magnetoresistive RAM (MRAM) persistent memory solutions, announced its partnership with Sage Microelectronics Corporation.
Silvaco Appoints Babak Taheri as New Chief Executive Officer
Silvaco, Inc. today announced that its Board of Directors has appointed Babak Taheri to the position of Chief Executive Officer. He will also join Silvaco’s Board of Directors. Taheri has served as Silvaco’s Chief Technical Officer and Executive Vice-President of Products since October 2018. He succeeds David Dutton who has been CEO since 2015. Dutton remains on the Silvaco Board in the position of Vice-Chairman. “The Board of Directors determined…
