Last year saw a 13.9% revenue decline for the top 20 OSATs and unit declines in every category of packages from ball grid arrays (BGAs) to quad flat no-lead (QFN) packages.
Packaging
Advanced Energy Introduces Intelligent, Fully Water-Cooled DC Power Supply
Ascent AMS II power supply with embedded IoT software facilitates innovation and increased productivity for industrial thin film deposition processes.
2023 Global Semiconductor Materials Market Revenue Declines From 2022 Record High, SEMI Reports
Global semiconductor materials market revenue in 2023 contracted 8.2% to $66.7 billion from the market record of $72.7 billion set in 2022, SEMI reported today.
Cohu Appoints Karen M. Rapp to its Board of Directors
Cohu, Inc. today announced that Karen M. Rapp has been appointed to the Cohu Board of Directors, effective today.
Empower’s New Ultra-low 1pH ESL Silicon Capacitor Tightens Voltage
Empower Semiconductor today unveiled the largest silicon capacitor in its ECAP product family for high frequency decoupling.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
mechatronic systemtechnik GmbH Unveils Technology Center in Fürnitz
mechatronic systemtechnik GmbH (mechatronic), a global supplier of automation equipment for critical wafer handling, announced the opening of its new cutting-edge technology center in Fürnitz.
The Flipping Future: Advancements in Flip Chip Packaging
Flip chip technology makes it possible to replace conventional wire interconnections with a direct and strong bond between chips and substrates. The future of silicon packaging is anticipated to be significantly influenced by flip chip technology to satisfy the increasing need for electronics that are faster, smaller, and more efficient.
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
Research published in Nature demonstrates high qubit control fidelity and uniformity in single-electron control.
Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024.
