Quantum Leap Solutions announced its recent appointment as an authorized North American reseller for Synopsys’ comprehensive suite of EDA, semiconductor IP, and cloud solutions.
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U.S. Department of Commerce Announces Two New Commitments to the CHIPS Women in Construction Framework
Announcement is part of Secretary Raimondo’s Million Women in Construction Initiative.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million
FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million.
TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
TopLine Corporation announces the introduction of braided solder columns as a drop-in replacement for solder spheres used in Ball Grid Array (BGA) components.
NY CREATES and Korea’s National Nano Fab Center Announce Research Partnership to Develop Joint Technology Hub
NY CREATES and the National Nano Fab Center announced a partnership which aims to develop a shared hub for enabling joint research, aligned technology services, testbed support, and an engineer exchange program to bolster chips-centered R&D, workforce development, and each nation’s respective high-tech ecosystem.
IDTechEx Summarizes the Emerging Adoption and Future Trends of SiC and GaN in EVs
In 2008, the commercialization of the silicon carbide (SiC) MOSFET marked a major turning point for the power semiconductor market, representing its first significant development in decades.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
High-end O-Rings to Grow 2x Faster than Wafer Starts
FFKM O-Rings remains low-risk pathway for semiconductor manufacturing.
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX).
Soitec Extends Partnership with UMC
Soitec (Euronext Paris) today announced the expansion of its partnership with UMC, a global semiconductor foundry company, to bring to the market the industry’s first 3D IC solution for Radio Frequency Silicon-on-Insulator (RF-SOI) technology for the 5G era.
