Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX).
Packaging
Soitec Extends Partnership with UMC
Soitec (Euronext Paris) today announced the expansion of its partnership with UMC, a global semiconductor foundry company, to bring to the market the industry’s first 3D IC solution for Radio Frequency Silicon-on-Insulator (RF-SOI) technology for the 5G era.
Alphawave Semi Expands Partnership with Samsung Foundry
Alphawave Semi has announced the expansion of its strategic partnership with Samsung Foundry, one of the world’s leading advanced semiconductor manufacturers.
Ayar Labs Welcomes Intel Veteran Pooya Tadayon as VP of Packaging and Test
Tadayon to accelerate ecosystem development and scalability for high-volume delivery of in-package optical I/O for next-generation AI systems.
SEMI Applauds New Legislative Solution to Address Gap in U.S. CHIPS Act Notice of Funding Opportunity
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, issued the following statement from Joe Stockunas, President of SEMI Americas.
Diraq Achieves Record Accuracy for Quantum Computing Device Manufactured by Existing Semiconductor Infrastructure
99.9% single-qubit fidelity demonstrated on quantum processing device utilizing industry-standard CMOS materials.
Pfeiffer Vacuum Introduces Dry Chiller Module for Container Closure Integrity Testing (CCIT) at Low Temperatures
Pfeiffer Vacuum introduces an addition to both new and existing leak detection systems: the Dry Chiller Module. Serving as an extended cooling component for ASM 2000 and AMI 1000 leak detectors, this module sets new benchmarks in producing dependable data for testing container closure integrity at low temperatures.
Miniaturizing a Laser on a Photonic Chip
Scientists led by Dr Yang Liu and Professor Tobias Kippenberg at EPFL have built the first ever chip-integrated erbium-doped waveguide laser that approaches the performance with fiber-based lasers, combining wide wavelength tunability with the practicality of chip-scale photonic integration.
Nordson Test & Inspection to Showcase Advanced Semiconductor Technologies at SEMICON West 2024
Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California.
Global Semiconductor Sales Increase 15.8% Year-to-Year in April
Worldwide chip sales increase 1.1% month-to-month in April, marking first month-to-month growth of 2024.
