The world’s leading forum for unveiling, discussing and exhibiting the latest advancements in microelectronics packaging and component science and technology is the IEEE Electronic Components and Technology Conference (ECTC).
Packaging
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
Last week, the Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries at their annual Women MAKE Awards
StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events
StratEdge Corporation is set to showcase its latest packaging technology for high-frequency applications at several industry conferences in May.
Nordson Electronics Solutions Receives EM China Innovation Award
Nordson Electronics Solutions received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat SL-1040 conformal coating system, at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada’s Semiconductor Industry
The agreements reflect a combined investment valued at approximately $187M CAD.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.
Micron Secures $6.1B in CHIPS Funding
The proposed CHIPS funding will underwrite Micron’s plans to build the largest leading-edge memory fabrication semiconductor facility in the U.S. in Clay, NY.
JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
JCET Group, a global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2024.
