ROHM and STMicroelectronics announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
Packaging
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
Samsung Electronics Co., Ltd. today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
The 2024 IEEE Symposium on VLSI Technology & Circuits To Showcase Breakthroughs in Microelectronics
For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains.
Syensqo Joins the SEMI Climate Consortium
The partnership aims to accelerate implementation of a sustainability roadmap across the entire value chain.
Lattice Wins 2024 Environment + Energy Leader Award
Lattice Semiconductor, the low power programmable leader, today announced its Lattice Avant FPGA platform was selected as a 2024 Environment + Energy Leader Award winner.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
New goals target additional reductions and removal of greenhouse gas emissions to help fight climate change.
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge logic fabs, a research and development fab, and an advanced packaging facility in Taylor, Texas.
Aaron Woolf, Dylan Peterson Join SIA Team
Woolf will serve as director of global policy for economic security and Peterson will be a communications associate.
SK hynix Partners with TSMC
SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
