Semtech Corporation, a high-performance semiconductor, IoT systems, and connectivity service provider, today announced the appointment of Dr. Hong Q. Hou, a current member of the Semtech Board of Directors, as President and Chief Executive Officer, effective June 6, 2024.
Packaging
With Programmable Pixels, Novel Sensor Improves Imaging of Neural Activity
New camera chip design allows for optimizing each pixel’s timing to maximize signal to noise ratio when tracking real-time visual indicator of neural voltage.
SEMI 3D & Systems Summit to Highlight Heterogeneous Systems for Intelligent Decision-Making and Real-Time Applications
The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration.
ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips
Following demand from customers, collaboration will provide a new supply of chips on GF’s power efficient and feature-rich 7HV semiconductor platform.
New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce.
Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology.
NY CREATES and TetraMem Forge Strategic Partnership
NY CREATES and TetraMem announced today that their partnership has led to the successful upscaling of TetraMem’s disruptive in-memory computing technologies from a 200mm wafer platform to the 300mm silicon platform, the foundation upon which next-gen AI computer chips are built.
CEA-Leti Reports Three-Layer Integration Breakthrough On the Path for Offering AI-Embedded CMOS Image Sensor
CEA-Leti scientists reported a series of successes in three related projects at ECTC 2024 that are key steps to enabling a new generation of CMOS image sensors (CIS) that can exploit all the image data to perceive a scene, understand the situation and intervene in it – capabilities that require embedding AI in the sensor.
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of microelectronics and electronics packaging, today formally introduced IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development.
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
