Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth.
Packaging
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
The report outlines key aspects of the work to execute on Congress’s mandate to advance opportunity and inclusion as it brings back manufacturing and supply chains to the U.S.
Infineon Provides FOXESS with Power Semiconductors
Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems.
Samsung to Establish Leading-Edge Semiconductor Ecosystem in Central Texas with CHIPS Act Funding
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Samsung Electronics (Samsung) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $6.4 billion in direct funding under the CHIPS and Science Act to strengthen the resilience of the U.S. semiconductor supply chain, advance U.S. technology leadership, and fuel U.S. global competitiveness.
SweGaN Announces RFHIC Strategic Equity Investment and Joint Product Development
SweGaN AB announces it has entered strategic partnership with South Korea based RFHIC Corporation.
Microchip Technology Acquires Neuronix AI Labs
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
Renesas Commences Operations of Kofu Factory
Renesas Electronics Corporation today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.
IMAPS & IPC to Host Onshoring Workshop
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Rapidus Announces U.S. Subsidiary and Opens Silicon Valley Office
Rapidus Corporation today announced it has formed a U.S. subsidiary, Rapidus Design Solutions (RDS); opened an office for the Americas in Santa Clara, California; and named long-time semiconductor executive Henri Richard as general manager and president of the U.S. organization.
Infineon and Amkor Announce Extended Partnership
Infineon Technologies AG is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services.
