The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from 2024 to 2028, according to Technavio.
Packaging
SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity
SEMI today issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States.
Semiconductor Research Corporation Announces 2024 Call for Research, $13.8M in Funding Opportunities
Semiconductor Research Corporation (SRC) is announcing the start of solicitation season with $13.8 million in funding opportunities.
Global Semiconductor Equipment Billings Slip to $106.3 Billion in 2023
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms
Micron’s automotive memory and storage enable central compute, digital cockpit and advanced driver-assistance systems for Qualcomm customers.
SEMI Applauds U.S. CHIPS Act Award for TSMC Manufacturing Facilities
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Breakthrough in Memory Technology: Next-Generation Optoelectronic Memory with Tellurene
Researchers developed a novel optoelectronic memory device that addresses the issues of conventional floating-gate nonvolatile memory devices.
SEMI University Launches In-Person Courses to Help Semiconductor Industry Workforce Build Skills
Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University learning platform to include in-person trainings.
Everspin Technologies Unveils PERSYST
Everspin Technologies, Inc. announced today the new brand name PERSYST for its persistent memory product family.
TSMC Awarded $6.6B in CHIPS and Science Act Funding for Investments in Arizona Fabs
TSMC announces 2nm technology at second fab and a new third fab to produce 2nm or more advanced chips.
