Empower Semiconductor will demonstrate its new Crescendo platform with FinFast technology at electronica 2024, the world’s leading trade fair and conference for electronics.
Packaging
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.
Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge
Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.
Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies
This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.
SIA Commends Selections for CHIPS R&D Flagship Facilities
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities.
Infineon Launches New Generation of GaN Power Discretes
Infineon Technologies AG today announced the launch of a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its Gallium Nitride (GaN) portfolio.
Research for the Future, Application Transfer for the Present
Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective.
Onto Innovation Announces “Tuck-In” Acquisition of Lumina Instruments, Inc. and Lithography Business of Kulicke and Soffa
Onto Innovation Inc., a global provider of process control and packaging lithography solutions to the semiconductor market, today announced that it has acquired Lumina Instruments, Inc. based in Milpitas, California.
Nordson Test & Inspection’s New SpinSAM AMI System Wins Prestigious Global Technology Award
Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the Test Equipment category.
US-Manufactured Nanopositioning Stage for Super Resolution Microscopy, Material Science
PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.
