Packaging

Pragmatic Semiconductor Set to Revolutionize NFC Connectivity with Sustainable Flexible Chips

Pragmatic Semiconductor Ltd. today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.

Launch of UC5000 Semiconductor Packaging Equipment Compatible with Large Glass Panels

Toray Engineering Co., Ltd. has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging.

The Shape of Tomorrow’s Semiconductor Technology

The theme of the 70th annual IEEE IEDM was “Shaping Tomorrow’s Semiconductor Technology.” Read about the latest advances in logic, memory, high frequency and power devices, and more.

Kulicke & Soffa Introduces Asterion-PW for Power Semiconductor Applications

Kulicke and Soffa Industries, Inc.  announced the launch of Asterion-PW, extending its leadership in power device applications with a fast and precise ultrasonic pin welding solution.

Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design

Silvaco Group, Inc. today announced that Faraday Technology Corporation has selected Silvaco’s FlexCAN IP to establish a robust networking backbone for its latest automotive ASIC design.

Veijo Kontas Joins proteanTecs Advisory Board

A veteran of the semiconductor and wireless industries, Kontas brings decades of expertise in SoC development to support proteanTecs’ strategic growth in telecommunications.

TECHCET Projects 5.9% Growth in CMP Consumables for 2025

TECHCET forecasts a 6% increase in CMP Consumables revenue for 2025, driven by advances in memory and logic chips.

Heraeus Covantics Unveils Manufacturing Plant in Shenyang, China

Heraeus, a global technology group, celebrated the official launch of its new Heraeus Covantics plant in Shenyang, northeast China.

ULVAC Developing Next-Generation Dilution Refrigerator for Quantum Computing by 2026

ULVAC, Inc. and ULVAC CRYOGENICS INC. announced that they are developing a next-generation dilution refrigerator for quantum computers with input from IBM.

New Ultra-Low Alpha Tin Plating Solutions Tackle Soft Errors in Shrinking Semiconductor Devices to Deliver Semiconductor Reliability

MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistry for the electronics industry, unveiled its new product range ‘Low Alpha Tin’ – innovative technology designed to address the growing problem of soft errors caused by alpha emissions in next-generation semiconductors.

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