Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility.
Packaging
MRSI Introduces MRSI-A-L Active Aligner
MRSI Systems (a part of Mycronic Group), a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, introduced the MRSI-A-L Active Aligner.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
Contributing to technical innovation in optical and digital devices by solving the need for greater miniaturization and higher density mounting of semiconductors.
President Biden Highlights Importance of Strong U.S. Semiconductor Supply Chains During State of the Union Address
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer regarding President Biden’s State of the Union address.
SkyWater Expands Board of Directors with Appointment of Dennis Goetz and Joseph Humke
SkyWater Technology, the trusted technology realization partner, today announced the appointment of two accomplished professionals to its board of directors: Dennis Goetz and Joseph Humke, effective April 1, 2024.
IDC Forecasts Global PC Shipments to Grow 2.0% in 2024
As the global economy nears recovery, so will the PC market with global shipments forecast to reach 265.4 million units in 2024, up 2.0% from the prior year.
SEMI Europe Honors Schneider Electric and ASM Leaders for Contributions to Semiconductor Industry
SEMI Europe today announced recipients of the SEMI European Award and Special Service Award for 2023 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2024).
Nordson to Demonstrate Plasma Treatment, Fluid Dispensing Systems at SEMICON China 2024
Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.
DuPont Renews Collaboration with Silicon Catalyst
Silicon Catalyst, the world’s only incubator focused exclusively on accelerating semiconductor solutions, announced today that DuPont has renewed its engagement as a Strategic Ecosystem Partner.
Heraeus Printed Electronics and SUSS MicroTec Announce Joint Development
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.
