Vishay Intertechnology, Inc. today announced that its Board of Directors has appointed David McConnell, Senior Vice President -Corporate Treasurer and Risk Management, to the role of Executive Vice President – Chief Financial Officer, replacing Lori Lipcaman who is resigning from that position.
Packaging
Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award
Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.
Samsung Develops Industry-First 36GB HBM3E 12H DRAM
Samsung Electronics Co., Ltd. today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.
IDTechEx Discusses Advancing Integration in Antenna Packaging Technologies for 5G and 6G
Millimeter-wave (mmWave), previously confined to military, satellite, and automotive radar applications, has now entered the mobile communications frequency spectrum, offering high data throughput of up to 20 Gbps with an ultralow latency of just 1 ms.
Micron Collaborates with Samsung on Galaxy S24 Series to Unlock the Era of Mobile AI Experiences
Samsung’s flagship Galaxy S24 Ultra, S24+ and S24 incorporate Micron’s high-performance, power-efficient LPDDR5X and UFS 4.0.
Scintil Achieves Integration of III-V DFB Lasers and Amplifiers with Standard Silicon Photonics Technology in Production at Tower Semiconductor
This significant milestone is pivotal in reinforcing Scintil’s supply chain and meeting growing demand for high-performance communication solutions in data centers, artificial intelligence (AI) and 5G networks.
National Institute for Innovation and Technology Hosts Arizona Semiconductor Panel Discussion
Institute’s panel brought together key stakeholders for panel discussion on workforce development in growing semiconductor manufacturing industry, highlights the City of Phoenix’s efforts.
Micron Commences Volume Production of Industry-Leading HBM3E Solution to Accelerate the Growth of AI
Micron Technology, Inc. today announced it has begun volume production of its HBM3E (High Bandwidth Memory 3E) solution.
Intel Foundry Expands Support for Ansys Multiphysics Signoff Solutions with Intel 18A Process Technology
Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.
